A dual-purpose flexible processing device for grinding and polishing for substrate processing

Abstract

The invention provides a dual-purpose flexible processing device used for grinding and polishing of substrate processing. The dual-purpose flexible processing device comprises a processing system main engine, a tool sucking disc tool, a pneumatic grinding tool and a pneumatic polishing tool, wherein both the pneumatic grinding tool and the pneumatic polishing tool adopt soft rubber rings with good elastic performances as flexible support to control and regulate gas charging pressure inside the rubber rings to change hardness of the processing tools, so that the surface residual stress of the processed substrate surface can be reduced, the warping problem which normally appears in substrate processing is avoided, the yield of substrate grinding and polishing is increased, and pollution to the environment is avoided. Meanwhile, the grinding process and the polishing process are integrated, so that the processing efficiency is improved, and the production cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of precision processing, and particularly relates to the ultra-precision grinding and polishing automatic processing of functional crystal substrates such as single crystal silicon wafers. Background technique [0002] The functional crystal substrate made of single crystal silicon crystal is used as the main substrate material of the integrated circuit, and its surface processing technology represents the most advanced manufacturing technology in ultra-precision processing. At present, the substrate obtained by slicing needs to be subjected to ultra-precision grinding and chemical mechanical polishing methods to achieve the required precision. The existing ultra-precision grinding methods all use a hard grinding wheel grinding method, and after polishing, a corrosion removal step is required to obtain an ultra-smooth and low-damage substrate surface. Due to the hard and brittle characteristics of the subst...

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Problems solved by technology

[0003] In order to overcome the disadvantages of the existing hard grinding wheel grinding and polishing methods, such as easy warping, deformation, and cracking, and the environmental pollution caused by mechanochemical polishing, and to achieve high-efficiency, low-loss, and clean crystal substrates Ultra-precision processing of wafers, the invention provides a flexible processing device for grinding and polishing for substrate processing. The pneumatic grinding tool and the pneumatic polishing tool use a soft rubber ring with good elasticity as a flexible support, and adjust the rubber ring through control. The inner inflation pressure of the ring changes the hardness of the processing tool, which can reduce the surface residual stress after substrate processing, so as to improve the yield of substrate grinding and polishing processing

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