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Preparation method of polyurethane mounting pad

A polyurethane and mounting pad technology, which is applied in the field of easy and fast preparation of polyurethane mounting pads, can solve problems such as uneven size and distribution, no compression rate and compression recovery rate, etc.

Active Publication Date: 2019-03-01
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since the previously known mounting pads exhibit non-uniform size and distribution of pores formed inside them, and do not have good compressibility and compression recovery, the mounting pads are insufficient in applications requiring more uniform and precise polishing. applications such as polishing of glass substrates for displays

Method used

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  • Preparation method of polyurethane mounting pad
  • Preparation method of polyurethane mounting pad
  • Preparation method of polyurethane mounting pad

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059]

[0060] A resin composition including the components of Table 1 below was coated on a PET film, and then, the coating was moisture-cured, washed, dehydrated, and dried to obtain a polyurethane resin film layer including pores inside. The obtained urethane resin film layer was buffed to have a more uniform thickness and high uniformity using a roller wound with sandpaper rotating at a high speed, and a pressure-sensitive double-sided adhesive tape was laminated on one side of the buffed urethane resin film layer to obtain polyurethane mounting pads.

[0061] And, the mounting mat was dipped in 0.1 M DBSA aqueous solution at 50° C. for 3 hours, washed, dehydrated, and dried to prepare a finished polyurethane mounting mat.

[0062] [Polyurethane layer: 1200μm, Adhesive layer: 250μm]

[0063] The compressibility and final weight average molecular weight of the prepared polyurethane mounting mats as a function of immersion time are reported in Table 2.

[0064] 【Table 1...

Embodiment 2

[0067]

[0068] A polyurethane mounting mat was obtained by the same method as in Example 1, except that the mat was dipped in a mixture of 0.1M SDS and 0.1M HCl at 50°C instead of 0.1M DBSA at 50°C.

[0069] [Polyurethane layer: 1200μm, Adhesive layer: 250μm]

[0070] The compressibility and final weight average molecular weight of the prepared polyurethane mounting mats as a function of immersion time are shown in Table 2 below.

Embodiment 3

[0071]

[0072] A polyurethane mounting mat was obtained by the same method as in Example 1, except that the mat was dipped in an aqueous solution of 0.5M BSA at 50°C instead of 0.1M DBSA at 50°C.

[0073] [Polyurethane layer: 1200μm, Adhesive layer: 250μm]

[0074] The compressibility and final weight average molecular weight of the prepared polyurethane mounting mats as a function of immersion time are shown in Table 2 below.

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Abstract

This disclosure relates to a method for preparing a polyurethane mounting pad comprising the steps of: wet-solidifying a resin composition comprising polyurethane resin and a DMF solvent; and immersing the wet-solidified product in an aqueous solution comprising an acid catalyst or a base catalyst. According to the present invention, long and large pores may be uniformly formed inside of the prepared pad, thus affording low hardness, excellent compressibility, and the like, and more uniform thickness, pressure distribution or tension distribution and the like may be exhibited over the whole area of the pad, thus providing a polyurethane mounting pad that can realize more uniform and high efficiency polishing.

Description

technical field [0001] The present invention relates to a method for preparing a polyurethane mounting mat, and more particularly, to a method for easily and rapidly preparing a polyurethane mounting mat having long and large pores uniformly formed inside it, thereby exhibiting a low Hardness, excellent compressibility and high elasticity for more uniform and efficient polishing. Background technique [0002] Since substrates used in highly integrated semiconductor devices or display devices require fine and precise surfaces, various planarization methods are used to achieve this requirement. In particular, with the development trend of high integration and high performance of semiconductor devices or display devices, a commonly used polishing method is to move the polishing pad and the object to be polished relatively, and at the same time will contain polishing particles and various chemical components. The slurry composition is provided between the polishing pad and the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J9/00C08L75/04C08G18/16C08J9/28B24B41/06
CPCB24D11/006B24B37/24B24D3/32C08G18/16C08J9/28C08J2201/0544C08J2205/06C08J2207/00C08J2375/04C08L75/04
Inventor 申东穆N·R·金安秉寅崔相洵太泳智申昌训
Owner LG CHEM LTD
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