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Method for preparing polyurethane support pad

A polyurethane, polyurethane resin technology, used in the manufacture of tools, grinding workpiece supports, metal processing equipment, etc., can solve the problems of no compression rate and compression recovery rate, uneven size and distribution, etc.

Active Publication Date: 2016-04-20
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since the previously known mounting pads exhibit non-uniform size and distribution of pores formed inside them, and do not have good compressibility and compression recovery, the mounting pads are insufficient in applications requiring more uniform and precise polishing. applications such as polishing of glass substrates for displays

Method used

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  • Method for preparing polyurethane support pad
  • Method for preparing polyurethane support pad
  • Method for preparing polyurethane support pad

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059]

[0060] A resin composition including the components of Table 1 below was coated on a PET film, and then, the coating was moisture-cured, washed, dehydrated, and dried to obtain a polyurethane resin film layer including pores inside. The obtained urethane resin film layer was buffed to have a more uniform thickness and high uniformity using a roller wound with sandpaper rotating at a high speed, and a pressure-sensitive double-sided adhesive tape was laminated on one side of the buffed urethane resin film layer to obtain polyurethane mounting pads.

[0061] And, the mounting mat was dipped in 0.1 MDBSA aqueous solution at 50° C. for 3 hours, washed, dehydrated, and dried to prepare a finished polyurethane mounting mat.

[0062] [Polyurethane layer: 1200μm, Adhesive layer: 250μm]

[0063] The compressibility and final weight average molecular weight of the prepared polyurethane mounting mats as a function of immersion time are reported in Table 2.

[0064] 【Table 1】...

Embodiment 2

[0067]

[0068] A polyurethane mounting mat was obtained by the same method as in Example 1, except that the mat was dipped in a mixture of 0.1 MSDS and 0.1 M HCl at 50°C instead of 0.1 MDBSA at 50°C.

[0069] [Polyurethane layer: 1200μm, Adhesive layer: 250μm]

[0070] The compressibility and final weight average molecular weight of the prepared polyurethane mounting mats as a function of immersion time are shown in Table 2 below.

Embodiment 3

[0071]

[0072] A polyurethane mounting mat was obtained by the same method as in Example 1, except that the mat was dipped in an aqueous solution of 0.5 MBSA at 50°C instead of 0.1 MDBSA at 50°C.

[0073] [Polyurethane layer: 1200μm, Adhesive layer: 250μm]

[0074] The compressibility and final weight average molecular weight of the prepared polyurethane mounting mats as a function of immersion time are shown in Table 2 below.

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Abstract

The present invention relates to a method for preparing a polyurethane support pad, the method comprising the steps of: wet-coagulating a resin composition comprising a polyurethane resin and a DMF solvent; and dipping the wet-coagulated product in an aqueous solution comprising an acid catalyst and a base catalyst. According to the present invention, it is possible to provide a polyurethane support pad capable of showing low hardness, excellent compressibility and the like by uniformly forming long and large pores inside the prepared pad, showing more uniform thickness, pressure distribution, tension distribution or the like all over the pad, and thereby implementing more uniform and efficient polishing.

Description

technical field [0001] The present invention relates to a method for preparing a polyurethane mounting mat, and more particularly, to a method for easily and rapidly preparing a polyurethane mounting mat having long and large pores uniformly formed inside it, thereby exhibiting a low Hardness, excellent compressibility and high elasticity for more uniform and efficient polishing. Background technique [0002] Since substrates used in highly integrated semiconductor devices or display devices require fine and precise surfaces, various planarization methods are used to achieve this requirement. In particular, with the development trend of high integration and high performance of semiconductor devices or display devices, a commonly used polishing method is to move the polishing pad and the object to be polished relatively, and at the same time will contain polishing particles and various chemical components. The slurry composition is provided between the polishing pad and the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/00C08L75/04C08G18/16C08J9/28B24B41/06
CPCB24D11/006B24B37/24B24D3/32C08G18/16C08J9/28C08J2201/0544C08J2205/06C08J2207/00C08J2375/04C08L75/04
Inventor 申东穆N·R·金安秉寅崔相洵太泳智申昌训
Owner LG CHEM LTD
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