Electrochemical polishing device and electrochemical polishing method using same

Abstract

The invention discloses an electrochemical polishing device and an electrochemical polishing method using the same. In the electrochemical polishing process, the calculation is performed according to the voltage change feedback of a power supply; the corresponding swing of a swing arm connected with a second nozzle is controlled according to the calculation result; and the position of the second nozzle relative to a first nozzle is adjusted along the edge of a wafer, so that the resistance in an electrical polishing loop is always kept in an original value state, the load change is low, the problem of difficult process control caused by polishing voltage change in the electrochemical polishing process can be prevented, the in-wafer uniformity after polishing is effectively improved, and the process interruption probability caused by high voltage is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing equipment, and more specifically, to an electrochemical polishing device and an electrochemical polishing method using the device. Background technique [0002] In the semiconductor manufacturing process, the polishing process is an essential step in the process of forming interconnect lines. As the feature size of semiconductor devices becomes smaller and smaller, the density of semiconductor devices on silicon wafers is getting higher and higher. Because the conductivity of metal copper is better than that of metal aluminum, metal copper has been widely used as interconnect metal in the semiconductor industry. . Metal copper is usually deposited on the wafer by an electroplating process, and then excess metal copper outside the wire slot is removed by a polishing process. [0003] see figure 1 , figure 1 It is an existing common electrochemical polishing device. Such as fi...

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Problems solved by technology

[0007] The object of the present invention is to overcome the above-mentioned defects existing in the prior art, provide an electrochemical polishing device and an electrochemical polishing method using the device, to solve the difficult control of the process caused by the change of the polishing voltage during the electrochemical polishing process, And lead to the problem of poor intra-chip uniformity of electrochemical polishing

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