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Polyimide nanometer composite with carbazole structure and preparation method and application of polyimide nanometer composite

A technology of nanocomposite materials and polyimide, which is applied in the field of material science to achieve the effects of low requirements, simple preparation process and various preparation processes

Active Publication Date: 2016-04-13
HUNAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still few studies on high-barrier polyimide and its nanocomposites with high planar structure. Therefore, it is necessary to carry out research on such high-barrier polyimide nanocomposites.

Method used

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  • Polyimide nanometer composite with carbazole structure and preparation method and application of polyimide nanometer composite
  • Polyimide nanometer composite with carbazole structure and preparation method and application of polyimide nanometer composite
  • Polyimide nanometer composite with carbazole structure and preparation method and application of polyimide nanometer composite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] At room temperature, under an argon atmosphere, 0.20g of mica (Mica) was sonicated in (46.3ml) N,N-dimethylformamide for 1h, and then 4.3745g (0.01mol) of bis(4-aminophenyl)9H- carbazole-3,6-dicarboxylate (CESPDA) and 2.1812g (0.01mol) 1,2,4,5-Benzenetetracarboxylicanhydride (1,2,4,5-pyromellitic dianhydride, PMDA) were added to N,N- In dimethylformamide, the solid content is 10%, and the reaction is stirred for 6 hours to obtain a homogeneous and viscous polyamic acid / mica composite glue. Then scrape and coat the polyamic acid / mica composite glue on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the temperature rise program is: the room temperature is raised to 100°C and then the temperature is kept constant for 1h→100°C to 200°C After ℃, the whole process of constant temperature is 1h→200℃ to 300℃, the whole process of constant temperature is 1h→300℃ to 400℃, and then the whole process is constant for 1h. After cooling, the polyimide / mica...

Embodiment 2

[0045] At room temperature, under argon atmosphere, 0.18g montmorillonite (MMT) was sonicated in (43.2ml) N,N-dimethylformamide for 2h, and 3.9348g (0.01mol) N1,N1'-(9 -methyl-9H-carbazole-3,6-diyl)bis(benzene-1,4-diamine)(9-M-CNPDA) and 2.1812g(0.01mol)1,2,4,5-Benzenetetracarboxylicanhydride(1,2 , 4,5-pyromellitic dianhydride, PMDA) was added to N,N-dimethylformamide, the solid content was 20%, and the reaction was stirred for 6 hours to obtain a homogeneous viscous polyamic acid / montmorillonite Composite glue. Then scrape and coat the polyamic acid / montmorillonite composite glue on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the temperature rise program is: the room temperature is raised to 100°C, and then the temperature is kept constant throughout the process for 1h→100°C. The whole process of constant temperature after reaching 200°C is 1h→200°C, temperature rises to 300°C, and the whole process of constant temperature is 1h→300°C, then t...

Embodiment 3

[0048] At room temperature, under an argon atmosphere, 0.03g graphene oxide (GO) was ultrasonicated in (46ml) N-methylpyrrolidone for 6h to obtain a graphene oxide dispersion. At the same time, 4.3548g (0.01mol) N3, N6- bis(4-aminophenyl)-9H-carbazole-3,6-dicarbazole-xamide (CAPDA) and 2.1812g (0.01mol) 1,2,4,5-Benzenetetracarboxylicanhydride (1,2,4,5-pyromellitic acid Dianhydride, PMDA) was added to N,N-dimethylformamide, the solid content was 30%, stirred and reacted for 6h to obtain a homogeneous viscous polyamic acid glue, and then the graphene oxide dispersion was poured into polyamic acid Polyamic acid / graphene oxide composite glue is obtained in the amic acid glue. Then scrape and coat the polyamic acid / graphene oxide composite glue on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the heating program is as follows: after the room temperature is raised to 100°C, the temperature is kept constant throughout the process for 1h→100°C. After re...

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Abstract

The invention discloses a polyimide nanometer composite with a carbazole structure and a preparation method and application thereof. High-planarity aromatic diamine with the carbazole structure, various types of tetracarboxylic dianhydride and layered nanometer particles are adopted as the raw materials for the composite. In the argon atmosphere, layered nanometer particles are dispersed in strong-polarity non-proton organic solvent, diamine and dianhydride are then added to dispersing liquid, and a polyamide acid composite adhesive solution is obtained after the mixture is stirred and reacts; or, the layered nanometer particles are dispersed, a polyamide acid adhesive solution is prepared from diamine and dianhydride in another container, and then a composite adhesive solution is prepared by mixing the nanometer particle dispersing liquid with the polyamide acid adhesive solution; finally, the polyimide nanometer composite is obtained by dehydrating polyamide acid. Molecule chains of polyimide have good planarity and rigidity; the composite prepared from polyimide and the layered nanometer particles through compositing has excellent thermal stability and isolation performance and can be widely applied to the fields of high-isolation packaging, device packaging and the like.

Description

technical field [0001] The invention relates to the field of material science, in particular to a polyimide nanocomposite material containing a carbazole structure and a preparation method and application thereof. technical background [0002] Because polyimide contains imide rings in its main chain, it has excellent thermal properties. It is one of the best heat-resistant varieties among engineering plastics that have been industrialized at present. It has comprehensive properties that other engineering plastics cannot match, such as High mechanical strength, good high and low temperature resistance, excellent dielectric properties, good film-forming performance, etc., are widely used in high-tech industries such as microelectronics, military industry, aerospace, high-performance packaging and protection, and electronic device packaging. [0003] With the continuous development of science and technology, some application fields not only require polyimide to have good therma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08K3/34C08K3/04
CPCC08G73/1028C08G73/1067C08G73/1085C08K3/04C08K3/34C08K3/346
Inventor 刘亦武黄杰谭井华柳俊杰曾义张海良刘跃军向贤伟
Owner HUNAN UNIV OF TECH
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