Rapid shaping device and method based on ultraviolet exposed dynamic mask plate technology

Abstract

The invention discloses a rapid shaping device and method based on an ultraviolet exposed dynamic mask plate technology. A novel efficient and environment-friendly rapid shaping technology is formed through utilizing an ultraviolet exposed dynamic mask plate, an ultraviolet exposed environment-friendly mask plate is generated through the permeation resistance action of ozone for ultraviolet, and an ozone mask plate is applied to the field of rapid manufacturing. According to the method, ultraviolet exposure can be carried out repeatedly, the reaction process is free of harmful gases, efficiency and environmental protection are achieved, and compared with a traditional rapid shaping machine, the rapid shaping device has the advantages that the cost is reduced, the service life of the device is prolonged, and the device is applicable to the fields of rapid manufacturing of medium and small batches of resin die samples, rapid trial production of novel products, and the like.

Description

technical field [0001] The method relates to the design of a purple light exposure control system, the design of an optical path, the exposure curing of a mould, and a molding process in the field of rapid manufacturing. Background technique [0002] In the process of researching the optical manufacturing of complex shapes, how to quickly generate arbitrary shapes of UV-friendly masks has become a problem that has plagued the industry for a long time. However, the service life of the traditional mask plate is limited by fog defects. The fog defect refers to that in a specific area, when the electron beam is exposed, some electrons are reflected on the surface of the photoresist, and the electrons reflected from the surface of the photoresist are again When it encounters a baffle placed on the photoresist, it is re-reflected to the photoresist to make it photosensitive. However, due to the atomization defect, the electrons are reflected in the air, so the collision probabilit...

AI Technical Summary

Problems solved by technology

However, the service life of the traditional mask plate is limited by fog defects. The fog defect refers to that in a specific area, when the electron beam is exposed, some electrons are reflected on the surface of the photoresist, and the electrons reflected from the surface of the photoresist are again When it encounters a baffle placed on the photoresist, it is re-reflected to the photoresist to make it photosensitive. However, due to the atomization defect, the electrons are reflected in the air, so the collision probability is smaller than that in the photoresist. Therefore, in the mask plate, fogging defects are a very important factor, but when the lithography wavelength is greater than 200nm, these defects will not cause too much problem, but when the lithography wavelength is less than 200nm, the affected mask plate will be Up to about 20%, making it difficult to improve the life of the mask

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