Sample treatment device

Abstract

The invention relates to the field of semiconductor manufacturing, and in particular relates to a sample treatment device. The sample treatment device fixes a sample to be treated in three directions; the part, which is in contact with the sample to be treated, of each fixing device is made from a silicon material, thus fulfilling an aim of fixing the sample to be treated; furthermore, the sample to be treated cannot be damaged by a metal material; meanwhile, one of the three-dimensional fixing devices is a mechanical structure with an adjustable depth, to control the height of the sample, and two fixing devices are used for fixing the position of the sample; a glass plane is used for guaranteeing the coplanar degree of the sample; on such basis, the sample can be fixed, and the coplanar degree of the sample can be guaranteed; therefore, the aim of easiness in grinding is fulfilled, and the sample is difficult to lose.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a sample processing device. Background technique [0002] When doing failure mode analysis, samples need to be processed, and the processing of ultra-small samples is more difficult than conventional samples, usually less than 4*4mm is considered an ultra-small sample. The most difficult step in the process is sample grinding. The reason for this is that the sample grinding process needs to be ground very precisely to the level that needs to be analyzed. If the target level is not ground, the failure mode cannot be established. Once the grinding is excessive, the It will lead to the disappearance of the target layer, resulting in the rejection of the target sample, both of which will affect the failure of the failure mode analysis. [0003] At present, when doing sample failure analysis, there are several modes for ultra-small sample grinding: [0004] 1. Ultra-small ...

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Problems solved by technology

[0005] 2. The ultra-small size sample has been cut from the whole wafer. This situation is difficult to deal with. Because the sample size is too small, subsequent processing is very difficult.

This kind of sample is also difficult to handle, and because the sample size is too small, it is also very difficult to process the sample later

[0007] For the grinding of ultra-small samples in the above 2 and 3 situations, the current processing method can only be controlled by personal experience. However, because the sample size is too small, the processing process is extremely difficult, especially when the target address is in ultra-small samples. Grinding is more difficult at the edge. Despite careful operation, excessive grinding often occurs, resulting in the scrapping of the sample; in addition, the sample size is too small, and the probability of loss during the sample drying and moving process is also higher than that of conventional samples. high

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