A kind of polyimide containing fluorene or fluorenone structure and its preparation method and application

A technology of polyimide and polyimide film, applied in the field of material science, to achieve high glass transition temperature and thermal stability, various preparation processes, and excellent barrier properties

Active Publication Date: 2018-03-09
HUNAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The research focus of this system is to design and synthesize a new type of high-barrier polyimide containing fluorene or fluorenone structure with high molecular chain rigidity and small free volume. However, no one has studied it so far, so it is necessary to develop new Design and synthesis of high barrier polyimide with or fluorenone structure

Method used

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  • A kind of polyimide containing fluorene or fluorenone structure and its preparation method and application
  • A kind of polyimide containing fluorene or fluorenone structure and its preparation method and application
  • A kind of polyimide containing fluorene or fluorenone structure and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] At room temperature, 4.3450g (0.01mol) N 2 ,N 7 -bis(4-aminophenyl)-9H-fluorene-2,7-dicarboxamide (FAPDA) and 43.51g (46.1ml) N,N-dimethylformamide were added to a 100ml three-necked flask, argon was introduced, and stirred , after completely dissolving, add 2.1812g (0.01mol) Pyromellitic dianhydride (pyromellitic dianhydride, PMDA), continue to stir and react for 6h, and obtain a homogeneous, transparent, viscous polyamic acid glue. Then scrape and coat the polyamic acid solution on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the heating program is as follows: the temperature is raised from room temperature to 100°C, and then the whole process of constant temperature is 1h → 100°C is heated to 200°C, and then the whole process is constant Process 1h→200°C, heat up to 300°C and then keep constant temperature. The whole process 1h→300°C, heat up to 420°C, then keep constant temperature. The whole process is 1.5h. After cooling, the polyi...

Embodiment 2

[0040] At room temperature, 4.78g (0.01mol) 1,1'-(9-oxo-9H-fluorene-2,7-diyl)bis(3-(4-aminophenyl)urea) (FUPDA) and 45.51g (48.8ml )N,N-Dimethylformamide was added to a 100ml three-necked flask, argon was introduced, stirred, and after it was completely dissolved, 2.1812g (0.01mol) of Pyromellitic dianhydride (pyromellitic dianhydride, PMDA) was added, and continued After stirring for 6 hours, a homogeneous, transparent and viscous polyamic acid solution was obtained. Then scrape and coat the polyamic acid solution on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the heating program is as follows: the temperature is raised from room temperature to 100°C, and then the whole process of constant temperature is 1h → 100°C is heated to 200°C, and then the whole process is constant Process 1h→200°C, heat up to 300°C and then keep constant temperature. The whole process 1h→300°C, heat up to 420°C, then keep constant temperature. The whole process is 1.5...

Embodiment 3

[0044] At room temperature, 5.3068g (0.01mol) N 1 ,N 1 '-((9H-fluorene-2,7-diyl)bis(4,1-phenylene))bis(benzene-1,4-diamine)(FPIPDA) and 49.92g (52.85ml) N,N-dimethyl Formamide was added to a 100ml three-necked flask, argon was introduced, stirred, and after it was completely dissolved, 2.1812g (0.01mol) of pyromellitic dianhydride (pyromellitic dianhydride, PMDA) was added, and the stirring reaction was continued for 6h to obtain a homogeneous, Transparent, viscous polyamic acid solution. Then scrape and coat the polyamic acid solution on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the heating program is as follows: the temperature is raised from room temperature to 100°C, and then the whole process of constant temperature is 1h → 100°C is heated to 200°C, and then the whole process is constant Process 1h→200°C, heat up to 300°C and then keep constant temperature. The whole process 1h→300°C, heat up to 420°C, then keep constant temperature. T...

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Abstract

The invention discloses polyimide of a fluorene-containing or fluorenone-containing structure as well as a preparation method and application of the polyimide. The polyimide material uses aromatic diamine of a high-planarity fluorene-containing or fluorenone-containing structure and various dianhydrides as raw materials; powder materials or films of the polyimide are prepared through hot imidization or chemical imidization. The lowest energy state structure of diamine monomers has high planarity and higher rigidity; the prepared polyimide molecular chain piling is tight, so that the prepared polyimide film has excellent blocking performance, higher vitrification conversion temperature, high thermal stability and lower heat expansion coefficient. The synthesis method has the advantage that the process is simple and diverse, so that the method is applicable to industrial production. The polyimide disclosed by the invention can be widely applied to the field of high and new technology industries such as micro-electronics, military industries, aerospace, high-performance package and protection and electronic device packaging.

Description

technical field [0001] The invention relates to the field of material science, in particular to a novel polyimide containing a fluorene or fluorenone structure and a preparation method thereof. technical background [0002] As the supporting and protecting component of the entire flexible device, the performance of the flexible substrate has an important impact on the quality and life of the flexible display device. Therefore, domestic and foreign attach great importance to the research and development of flexible substrates. In general, the performance requirements of flexible display devices for substrate materials are mainly reflected in several aspects: (1) have excellent heat resistance and high temperature dimensional stability; (2) have good flexibility; (3) have very Excellent barrier properties, among them, LCD devices require materials with a WVTR value of 10 -2 ~10 -1 g / m 2 d, while the requirements for OLED devices are much higher. It is generally believed t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18
CPCC08G73/1007C08G73/1067C08G73/1071C08J5/18C08J2379/08
Inventor 刘亦武王倩谭井华黄杰熊宇风何伟林曾义柳俊杰
Owner HUNAN UNIV OF TECH
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