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Treatment production line of lead frame

A lead frame and production line technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as unreasonable operation settings and low efficiency, achieve optimal processing results, reduce contact area, and simple structure Effect

Active Publication Date: 2016-03-23
SHANGHAI SINYANG SEMICON MATERIALS
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  • Summary
  • Abstract
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Problems solved by technology

The processing equipment for lead frames in the prior art is generally inefficient and the operation settings are not very reasonable

Method used

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  • Treatment production line of lead frame
  • Treatment production line of lead frame
  • Treatment production line of lead frame

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Experimental program
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Effect test

Embodiment Construction

[0086] The present invention is described in detail below in conjunction with accompanying drawing:

[0087] see Figure 1 to Figure 3 , which is a schematic structural diagram of a lead frame processing production line 801 provided by the present invention. The lead frame processing production line 801 includes a lead frame retrieving mechanism 600 , a lead frame processing tank 100 , a lead frame clamp 500 , a lead frame pushing device 200 and a water knife 450 . According to requirements, in this embodiment, in order to facilitate the automatic transfer operation, the processing production line 801 of the lead frame includes a corresponding feeding device and a feeding device. The lead frame processing production line 801 also includes corresponding computer control equipment, casings, brackets, etc., which are not the focus of the present invention, and will not be described in detail here.

[0088] Please also refer to Figure 4 , the discharging device includes a firs...

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Abstract

The invention discloses a treatment production line of a lead frame. The treatment production line of the lead frame comprises a material taking mechanism, a lead frame treatment groove, a lead frame jig, lead frame pushing equipment and a water jet cutter, wherein a material pushing device of the material taking mechanism is driven by a first driving device and can realize automatic working; an immobilizing mechanism of the lead frame treatment groove is used for maintaining a semiconductor lead frame at a vertical position, so that the semiconductor lead frame is small in occupied space and long in soaking time, and a better soaking effect is obtained; a liquid receiving groove formed in the lead frame jig can be used for completely receiving a chemical treatment solution dripping from the lead frame, so that the phenomenon that since the chemical treatment solution drips on structures such as an air cylinder and guide rails, the corrosion is caused is avoided.

Description

technical field [0001] The invention relates to lead frame processing equipment in the semiconductor field, in particular to a lead frame processing production line. Background technique [0002] In the field of integrated circuits, it is generally necessary to use a lead frame as a carrier for integrated circuit chips. The lead frame uses bonding materials such as gold wire, aluminum wire, and copper wire to realize the electrical connection between the lead-out end of the chip's internal circuit and the external lead, forming a key structural part of the electrical circuit, which acts as a bridge connecting the external wire. Due to the high-precision production requirements of integrated chips, the lead frame needs to be smooth without burrs. Therefore, chemical soaking is generally required to facilitate further processing. The processing equipment for the lead frame in the prior art is generally inefficient, and the operation settings are not very reasonable. Conten...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/48
CPCH01L21/48H01L21/4821H01L21/67011H01L21/67017H01L21/67144
Inventor 黄春杰陈概礼黄利松
Owner SHANGHAI SINYANG SEMICON MATERIALS
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