Recycling method of low-viscosity high-heat-conductivity silicon carbide cutting fluid

Abstract

The invention discloses a recycling method of low-viscosity high-heat-conductivity silicon carbide cutting fluid. The recycling method comprises the following steps: (1) collecting the cutting fluid for precipitating and recovering settled matters in the cutting fluid in a primary settling pond, and delivering the supernatant to a cutting fluid buffer tank; (2) measuring the specific gravity of the cutting fluid, and determining a PH value; (3) when the specific gravity exceeds the range of 0.86 to 0.88 or the PH value exceeds the range of 5 to 7, supplementing 100ml of ethylene glycol, and supplementing 2 to 5 parts of glycerinum and 2 to 5 parts of diethyl amine phthalate; and returning the adjusted cutting fluid to be sprayed; (4) when the viscosity of the cutting fluid in the cutting fluid buffer tank is more than 60mPa.s, scraping the cutting fluid, and replacing the cutting fluid. The maintenance and recycling method of the cutting fluid is simple, the primary recycling of the cutting fluid is realized, a recycling device is simple and low in cost, and the separated settled matters also can be recycled.

Description

technical field [0001] The invention belongs to the technical field of chemistry and chemical engineering, and in particular relates to the recovery of wire cutting fluid used for monocrystalline silicon and silicon carbide slices. Background technique [0002] In the production process of silicon wafer cutting, as the responsible consumables for wire cutting, silicon wafer cutting fluid is indispensable. The suspending ability, cooling performance, lubricating performance and mortar dispersion performance of the cutting fluid largely determine the precision and efficiency of silicon wafer cutting. At present, common silicon wafer cutting fluids on the market are still lacking in heat dissipation and cooling performance, especially in high-frequency cutting. Moreover, as the cutting progresses, if the metal wire wears to a certain extent, the lubricating performance will decrease, resulting in a decrease in cutting accuracy, and some have poor resistance to impurities. It ...

AI Technical Summary

Problems solved by technology

At present, the common silicon wafer cutting fluids on the market are still lacking in heat dissipation and cooling performance, especially in high-frequency cutting.

Moreover, as the cutting progresses, if the metal wire wears to a certain extent, the lubricating performance will decrease, resulting in a decrease in cutting accuracy, and some have poor resistance to impurities. Will lead to a significant decline in the performance of the cutting fluid