Solder paste for signal processing base board and preparation method of solder paste

A technology for signal processing substrates and solder paste, which is applied in manufacturing tools, welding equipment, metal processing equipment, etc., and can solve the problems of reduced solder powder wettability, increased solder paste manufacturing cost, and easy oxidation.

Active Publication Date: 2016-03-02
芜湖雅葆轩电子科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, there is a problem with solder pastes containing Sn-Zn based lead-free solder powders (Sn-Zn based solder pastes): Zn is a metal that is easily oxidized due to its high ionization tendency; An oxide layer is formed on the surface of the solder powder in the air, which reduces the wettability of the solder powder
[0009] However, this encapsulation adds to the manufacturing cost of the solder paste and is not necessarily effective in improving solder wetting or solderability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0021] The invention provides a method for preparing a solder paste for a signal processing substrate, comprising:

[0022] 1) mixing Sn-Zn alloy, nickel, cobalt, chloroauric acid tetrahydrate, polyvinylpyrrolidone, reducing agent and water for contact reaction to prepare an activated metal composition;

[0023] 2) heating and dissolving rosin, rosin amine, organic acid, imidazole and diallyl isocyanuric acid to prepare mixed solution I;

[0024] 3) mixing the mixed solution I, the thixotropic agent and the preservative, and then cooling to obtain the mixed solution II;

[0025] 4) mixing liquid II with polyethylene glycol to prepare soldering flux;

[0026] 5) Refrigerating the soldering flux; then, in the presence of X-rays, disperse and mix it with the activated metal composition under vacuum to prepare a solder paste for signal processing substrates.

[0027] In step 1) of the method, the consumption of each material can be selected in a wide range. On the premise of cos...

Embodiment 1

[0044] 1) Sn-Zn alloy (containing 88% by weight of tin and 12% by weight of zinc), nickel, cobalt, chloroauric acid tetrahydrate, polyvinylpyrrolidone (weight average molecular weight is 2500), reducing agent (sodium citrate) Mix with water according to the weight ratio of 100:1.3:0.7:13:12:13:180, and conduct a contact reaction at 80°C for 4 hours to prepare an activated metal composition;

[0045] 2) Mix rosin, rosin amine, organic acid (malic acid), imidazole, and diallyl isocyanuric acid in a weight ratio of 100:35:20:13:7, and heat and dissolve at 155°C for 70 minutes to prepare Obtain mixed solution I;

[0046] 3) Mix the mixed solution I, the thixotropic agent (fumed silica) and the preservative (sodium nitrite) according to the weight ratio of 100:19:22, and then cool to 25°C to prepare the mixed solution II;

[0047] 4) Mix the mixed solution II with polyethylene glycol (100:11 by weight) to prepare flux;

[0048] 5) The flux was refrigerated at 3°C ​​for 17 hours; ...

Embodiment 2

[0050] 1) Sn-Zn alloy (containing 85% by weight of tin and 15% by weight of zinc), nickel, cobalt, chloroauric acid tetrahydrate, polyvinylpyrrolidone (weight average molecular weight is 1500), reducing agent (sodium citrate) Mix with water in a weight ratio of 100:1:0.5:10:8:10:150, and conduct a contact reaction at 75°C for 2 hours to prepare an activated metal composition;

[0051] 2) Mix rosin, rosin amine, organic acid (salicylic acid), imidazole, and diallyl isocyanuric acid in a weight ratio of 100:30:15:9:4, and heat and dissolve at 145°C for 50 minutes. Prepare mixed solution I;

[0052] 3) Mix the mixed solution I, the thixotropic agent (fluorobentonite) and the preservative (hydroquinone) according to the weight ratio of 100:18:17, and then cool to 15°C to prepare the mixed solution II;

[0053] 4) Mix the mixed solution II with polyethylene glycol (100:7 by weight) to prepare flux;

[0054] 5) The flux was refrigerated at 1°C for 15 hours; then, in the presence o...

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Abstract

The invention discloses solder paste for a signal processing base board and a preparation method of the solder paste. The preparation method comprises the following steps of (1) mixing Sn-Zn alloy, nickel, cobalt, hydrated chloroauric acid, polyvinylpyrrolidone, reducing agents and water for contact reaction, so as to prepare an activated metal composition; (2) heating to dissolve rosin, rosin amine, organic acid, imidazole and diallyl phthalate isocyanuric acid, so as to prepare a mixed solution I; (3) mixing the mixed solution I, thixotropic agents and preservatives, and then cooling, so as to prepare a mixed solution II; (4) mixing the mixed solution II and polyethylene glycol, so as to prepare flux; (5) refrigerating the flux, and then dispersing and mixing the flux with the activated metal composition under vacuum in the presence of X rays, so as to prepare the solder paste for the signal processing base board. The solder paste prepared by using the preparation method has the advantages of excellent chemical stability, low welding temperature and excellent extension rate.

Description

technical field [0001] The invention relates to solder paste, in particular to a solder paste for a signal processing substrate and a preparation method thereof. Background technique [0002] Due to the introduction of relevant environmental protection regulations such as Rohs and REACH in the European Union, lead in traditional tin-lead alloys has been gradually replaced by lead-free alloys containing silver and bismuth under environmental bans. However, silver is a rare non-renewable resource. As the market's demand for electronic products continues to expand, and the replacement cycle of electronic products is getting shorter and shorter, silver is constantly being consumed, and the price of silver keeps rising, resulting in high costs. [0003] The existing lead-free solders are basically Sn-based alloys, which contain a large proportion of Sn and one or more alloying elements, such as: Ag, Cu, Bi, In, Sb or Zn. Among them, Sn-based solders containing Ag (Sn-Ag-based so...

Claims

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Application Information

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IPC IPC(8): B23K35/363B23K35/26B23K35/40
CPCB23K35/262B23K35/362B23K35/40
Inventor 胡啸宇
Owner 芜湖雅葆轩电子科技股份有限公司
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