Copper clad laminate hydraulic pressurization forming device

Abstract

The invention provides a copper clad laminate hydraulic pressurization forming device comprising a laminating container and a control device which is arranged at the external wall of the laminating container. A pressure control device is arranged on the cover of the container and the pressure control device is used for controlling the pressure value in the laminating container. A laminating container body is internally provided with a vacuum bag which is used for internally arranging multiple copper clad laminates to be laminated and formed. The bottom part of the laminating container body is provided with a heating device. The internal wall of the laminating container body is provided with multiple temperature sensors and pressure sensors. The control device controls the heating device to heat a liquid medium and controls the pressure control device to enable the laminating container to be within an appropriate pressure range so as to complete lamination operation. With application of the technical scheme, the lamination process of the copper clad laminates is completed in the liquid medium of the sealed container so that the surface of the lamination sample is enabled to be uniformly pressurized. Meanwhile, accurate control of pressure and temperature can be realized in the lamination process and warping degree of the laminated product is low.

Description

technical field [0001] The invention relates to the technical field of copper clad laminate preparation, in particular to a hydraulic pressure forming device for copper clad laminates. Background technique [0002] Copper Clad Laminates are substrate materials used to manufacture printed circuit boards (PCBs). In the prior art, they are usually composited and hot-pressed by substrates, insulating dielectric adhesive layers and copper foils. Since the hot pressing process is completed in air or vacuum, the molding pressure is relatively high, and the lamination force on the surface of the copper clad laminate is not uniform, which leads to high warpage and poor uniformity of the pressed product. [0003] Therefore, in view of the above-mentioned defects existing in the current prior art, it is necessary to conduct research to provide a solution to solve the defects existing in the prior art. Contents of the invention [0004] In order to solve the problems existing in the ...

AI Technical Summary

Problems solved by technology

Since the hot pressing process is completed in air or vacuum, the forming pressure is relatively high, and the lamination force on the surface of the copper clad laminate is not uniform, which leads to high warpage and poor uniformity of the pressed product.

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