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Formation method of nand flash memory device

A technology of flash memory devices and core devices, which is applied in the field of formation of NAND flash memory devices, can solve problems such as poor performance of NAND flash memory devices, and achieve the effect of improving performance

Active Publication Date: 2018-12-21
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

NAND flash memory devices formed by existing methods have poor performance

Method used

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  • Formation method of nand flash memory device
  • Formation method of nand flash memory device
  • Formation method of nand flash memory device

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Experimental program
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Embodiment Construction

[0036] As stated in the background technology, the performance of NAND flash memory devices formed by existing methods is not good, and the reasons are as follows:

[0037] when to Figure 1 to Figure 4 After the NAND flash memory device is formed by the method shown, it is found through the transmission electron microscope that the sidewall of the first gate 111 in the NAND flash memory device is not flat, and further analysis shows that after the trench 104 is formed, the gate 111 is obviously damaged; it turns out In the process of forming the trench 104, the corresponding etching process will cause a certain etching effect on the sidewall of the first gate 111, resulting in that the subsequent ONO layer cannot be well covered on the sidewall of the first gate 111, and This further causes performance degradation of the NAND flash memory device.

[0038]In addition, in the existing method, the photoresist layer 103 is formed after removing the second hard mask layer 122 and ...

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Abstract

A formation method of an NAND flash memory device comprises the following steps of providing a semiconductor substrate, wherein the semiconductor substrate possesses a core device area and a peripheral circuit area located on an edge of the core device area; forming a plurality of first discrete grid structures on the core device area and first hard mask layers located on the first grid structures, wherein each first grid structure comprises a first grid and a first grid dielectric layer; forming first dielectric layers on two sides of the first grid structures; etching the first dielectric layers till that a groove which exposes a first grid sidewall is formed; carrying out scouring technology on a side wall of the groove; after the scouring technology is performed, removing the first hard mask layers. By using the formation method, performance of the NAND flash memory device can be increased.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for forming a NAND flash memory device. Background technique [0002] Among the non-volatile semiconductor memories, there are Electrically Erasable Programmable Read Only Memory (EEPROM) and Electrically Programmable Read Only Memory (EPROM). EEPROM includes FLASH EEPROM. A popular FLASH EEPROM architecture utilizes a NAND array with a large number of strings of memory cells connected by one or more select transistors between each bit line and a common source line, commonly known as a NAND flash memory device . [0003] The standard physical structure of a NAND flash memory device is called a memory cell (bit). In a NAND flash memory device, gates and conductive channels of different MOS transistors are separated by a gate insulating layer. The insulating layer is generally an oxide layer (gate oxide), and the NAND flash memory device has an additional lay...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/115H01L27/11524H01L21/02
Inventor 任佳张翼英
Owner SEMICON MFG INT (SHANGHAI) CORP
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