Wavelength division multiplex light receiving assembly
A wavelength-division multiplexing and wavelength-division multiplexing technology, applied in the field of optical communication, can solve problems such as the manifestation of advantages and complex optical path structure, and achieve the effects of increasing stability and reliability, simplifying optical path structure, and reducing packaging difficulty.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0046] Such as Figure 4 As shown, a planar optical waveguide integrated wavelength division multiplexing chip 1 , a photodetector array chip 2 , and an optical fiber assembly 3 are arranged in a packaging case 4 . The input end surface 11 of the planar optical waveguide integrated wavelength division multiplexing chip is the same polished surface as the coupling port of the optical fiber component, and is glued together with the coupling port 31 of the optical fiber component. The output end surface 12 of the planar optical waveguide integrated wavelength division multiplexing chip is an uncoated polished surface, which forms an angle of 40° with the waveguide surface 13, and the light in the output waveguide is totally reflected on the output end surface 12 and enters the photodetector. The photodetector chip array 2 is located on the reflective light path below the output end surface 12 of the planar optical waveguide integrated wavelength division multiplexing chip. There ...
Embodiment 2
[0049] Such as Figure 5As shown, a planar optical waveguide integrated wavelength division multiplexing chip 1 , a photodetector array chip 2 , and an optical fiber assembly 3 are arranged in a packaging case 4 . The input end surface 11 of the planar optical waveguide integrated wavelength division multiplexing chip is the same polished surface as the coupling port of the optical fiber component, and is glued together with the coupling port 31 of the optical fiber component. The output end face 12 of the planar optical waveguide integrated wavelength division multiplexing chip is polished and forms a 50° angle with the waveguide surface 13. The output end face 12 of the planar optical waveguide integrated wavelength division multiplexing chip is also coated with a reflective film. The reflectivity of light on this surface is greater than 80%. The photodetector chip array 2 is located on the reflective light path below the output end surface 12 of the planar optical waveguid...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com