LED bracket and production method thereof

A technology of LED bracket and production method, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as affecting heat dissipation and poor appearance, and achieve the effect of ensuring area, heat dissipation performance without damage, and solving poor appearance

Active Publication Date: 2019-09-17
东莞智昊光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide an LED bracket and its production method, which can weaken the phenomenon of glue overflow and ensure the appearance yield and heat dissipation performance of the LED bracket.

Method used

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  • LED bracket and production method thereof
  • LED bracket and production method thereof
  • LED bracket and production method thereof

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Embodiment Construction

[0021] like image 3 and Figure 4 As shown, the LED bracket provided by the present invention includes an insulating body 230 and at least a pair of conductive terminals 220 and 221 combined with the insulating body 230 . Specifically, in this embodiment, only a pair of conductive terminals 220, 221 are shown, and it can be understood that in other embodiments, the number of conductive terminals 220, 221 can be adjusted according to different needs. The conductive terminal 221 serves as the carrier of the LED chip. The conductive terminals 220, 221 are electrically connected to the LED chip at the same time, and the conductive terminals 220, 221 are connected to an external power source, so that the LED chip can emit light and work normally. The surfaces of the conductive terminals 220 and 221 opposite to the LED chips can be used to connect to external circuits, and also serve as heat dissipation channels for the LED chips.

[0022] The insulating body 230 is generally com...

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Abstract

The invention relates to an LED bracket comprising an insulation body and at least one pair of conductive terminals combined with the insulation body. One surface of one conductive terminal forms a reflection cup through stamping, and the other surface opposite the surface projects to form a deformation part. The deformation part is composed of a bottom surface, a stretching surface, and an edge arc located between the bottom surface and the stretching surface, wherein the stretching surface is combined with the insulation body, and the length of the edge arc is 0.05-0.1mm. The invention further relates to a production method of the LED bracket. Through step-by-step stamping, the extrusion force borne by the material belt in the stamping process is reduced, and the length of the edge arc between the bottom surface and the stretching surface of the deformation part, formed through stamping, of the conductive terminal is reduced. Therefore, the phenomenon of glue overflow caused by a gap produced between an overlarge edge arc and an injection mold during forming of the insulation body is avoided, and the appearance yield and the heat dissipation performance of the LED bracket are ensured.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to an LED bracket used when packaging LED chips, and a production method of the LED bracket. Background technique [0002] As a new light source, LED has been widely used in lighting, backlight, signal display and other fields. Before the LED terminal application, the LED chip needs to be packaged. Generally, the LED packaging structure includes an LED bracket for carrying LED chips, and an encapsulation glue covering the LED chips. According to different application requirements, phosphor powder may be mixed in the encapsulant to provide light of different colors. The LED bracket usually includes an insulating body and a conductive terminal integrally formed in the insulating body, and generally the conductive terminal is formed first, and then the insulating body is formed on the conductive terminal by means of injection molding, and the conductive terminal is partially exposed during moldin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L33/64
Inventor 张永林孙业民潘武灵陈文菁刘泽
Owner 东莞智昊光电科技有限公司
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