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Heat distribution analysis method for chip structures

A technology of chip structure and analysis method, applied in special data processing applications, instruments, electrical and digital data processing, etc., can solve problems such as inability to analyze three-dimensional thermal distribution and complexity

Active Publication Date: 2016-02-03
SOUTHEAST UNIV
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Problems solved by technology

The two-dimensional temperature distribution obtained by this method needs to use the circuit simulator to obtain the calculation results, but the thermal distribution it solves is two-dimensional discretization and is relatively complicated
Two-dimensional heat distribution thermal model, unable to analyze three-dimensional heat distribution

Method used

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  • Heat distribution analysis method for chip structures
  • Heat distribution analysis method for chip structures
  • Heat distribution analysis method for chip structures

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Embodiment Construction

[0028] The present invention will be further explained below in conjunction with the accompanying drawings.

[0029] Such as figure 1 As shown, in the present embodiment, each parameter is valued, thermal conductivity k=210000pW / (μm K), the size of the tiny heat source Δx=10 μm, Δy=100 μm, Δz=0.45 μm; heat convection coefficient h=100 ; Room temperature T 0 = 25°C, r 1 = 15 μm, r 2 =100000 μm; chip structure size L=10000 μm, W=5000 μm, δ=500 μm; heat generation rate g=100000.

[0030] The specific steps are as follows:

[0031] Step 1: If figure 2 As shown, the chip structure is discretized to obtain 6 nodes, (i,j,l) is the coordinates of the center point of the surface tiny heat source, (i+1 / 2,j,l), (i-1 / 2,j,l ), (i,j-1 / 2,l) and (i,j+1 / 2,l) are the midpoint coordinates of the four sides of the surface, and (i,j,l+1) is The coordinates of the center point of the bottom surface of the chip. Among them, the discrete nodes can be determined according to the structural pa...

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Abstract

The invention discloses a heat distribution analysis method for chip structures, and aims at providing a three-dimensional structure heat distribution estimation method which is high in sped, high in efficiency and low in error. According to the method, two steps are adopted to process the heat distribution of the three-dimensional structure, so that a heat distribution analysis model with low error under different heat generation rates is obtained. On one hand, a lumped circuit model is used for analyzing the temperature value at the highest temperature point of the tiny heat source on the surface of the three-dimensional structure; and on the other hand, a spherical coordinates-based spherical wall heat conduction equation is utilized to obtain the heat distribution of the whole three-dimensional structure by taking the temperature value at the highest temperature point as a boundary condition. According to the three-dimensional structure-based heat distribution analysis model algorithm, the calculation accuracy is ensured, the calculation amount for analyzing the heat distribution of the three-dimensional structure is greatly decreased, the analysis efficiency is improved and the calculation speed is improved.

Description

technical field [0001] The invention relates to a heat distribution analysis method, in particular to a heat distribution analysis method for a chip structure. Background technique [0002] With the rapid development of integrated circuit technology, the electronics industry needs to produce lighter, smaller and higher-performance portable electronic products. Based on this, high-density integration technologies such as TSV and 3DIC in integrated circuits have obvious advantages, but heat loss and corresponding heat-induced stress are more serious than traditional single-chip structures. Therefore, effective thermal analysis and thermal design in chip design are very necessary. In order to realize the thermal distribution analysis of the chip structure, there are usually two approaches: the three-dimensional model simulation analysis method and the lumped circuit method. For the 3D model simulation analysis method, it is realized by establishing a corresponding 3D structur...

Claims

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Application Information

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IPC IPC(8): G06F17/50
Inventor 韩磊仝振阳
Owner SOUTHEAST UNIV
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