Method for analyzing convection heat dissipation performance of both sides of rectangular heat dissipation plate with eccentric heat source

Abstract

The present invention relates to a method for analyzing convection heat dissipation performance of both sides of a rectangular heat dissipation plate with an eccentric heat source. The method comprises: dividing a heat source region into uniform grids and combining a heat loss matrix and a non-uniform thermal power matrix of the heat source region, to iteratively calculate surplus temperature iteration values of all nodes in the heat source region; after determining that iteration results are convergent by using a difference between an average value of the surplus temperature iteration results and an average value of last iteration results, collecting statistics on a local greatest value of the surplus temperatures in the heat source region; dividing upper and lower surfaces in a region without any heat source into grids, and calculating an average value of node surplus temperatures to obtain total convection heat dissipation power of the upper and lower surfaces in the region without any heat source; according to the local highest value of the surplus temperatures in the heat source region, the average value and the total convection heat dissipation power of the the upper and lower surfaces in the region without any heat source, and two-dimensional heat source uniform heating power, obtaining maximum diffusion thermal resistance corresponding to heat dissipation from a heat source to the upper and lower surfaces of the heat dissipation plate, and maximum total heat resistance from the heat source to the environment. According to the method of the present invention, the heat dissipation problem is described visually, and obtained data is more comprehensive.

Description

technical field [0001] The invention belongs to the technical field of encapsulation and heat dissipation of electronic devices, and in particular relates to a method for analyzing the heat dissipation performance of a rectangular heat dissipation plate in which a heat source of a device is eccentrically packaged on the upper surface of a rectangular heat dissipation plate and both upper and lower surfaces are in a convective cooling state. Background technique [0002] While electronic devices are developing according to the trend of miniaturization, their electronic functions are also improving day by day. The higher and higher chip integration level leads to the increase of power consumption per unit area and the gradual increase of chip junction temperature. In order to avoid shortening the service life and reliability of the device due to excessive junction temperature, packaging the device on the surface of the finned heat sink is the most common heat dissipation method...

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Problems solved by technology

However, due to the use of the equivalent thermal path analysis method, the above method can only calculate the average temperature of the heat source and the average thermal diffusion resistance value, and cannot accurately obtain the temperature value on any specified coordinates, so there is still the possibility of underestimating the local maximum temperature

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