Cationic UV and heat dual deeply-curing adhesive and preparation method thereof
A deep curing, cationic technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve the problems of not being able to achieve fast deep curing, achieve short curing reaction time, simple and easy process Effects of handling, excellent adhesion and mechanical properties
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specific Embodiment approach 1
[0028] Specific embodiment 1: This embodiment is a cationic ultraviolet light and heat dual deep-curing adhesive consisting of 60 to 100 parts of oligomeric resin mixture containing epoxy groups, 5 to 30 parts of diluent, It is prepared by 5-15 parts of coupling agent, 0.75-3 parts of photoinitiator, 0.75-3 parts of photosensitizer, 0.075-0.5 part of thermal initiator and 0-0.2 part of thermal stabilizer.
[0029] The advantage of this implementation mode:
[0030] 1. A cationic ultraviolet light and heat dual deep-curing adhesive prepared in this embodiment is cured by dual initiation means of ultraviolet light and heat. After being irradiated by ultraviolet light, it reacts rapidly, and at the same time, the heat generated by ultraviolet light is used to initiate a thermal curing reaction. process, so as to achieve rapid deep curing;
[0031] 2. A cationic ultraviolet light and heat double deep-curing adhesive prepared in this embodiment does not need post-heating to initia...
specific Embodiment approach 2
[0036] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the described oligomeric resin mixture containing epoxy groups is prepared according to the following steps:
[0037]Heat the resin containing bifunctional epoxy groups from room temperature to 60°C to 80°C at a stirring speed of 100r / min to 150r / min; Add oligomers containing multifunctional epoxy groups at 60°C to 80°C; then stir and react at a stirring speed of 150r / min to 200r / min and a temperature of 60°C to 80°C for 6h to 18h , to obtain an oligomeric resin mixture containing epoxy groups;
[0038] The mass ratio of the bifunctional epoxy group-containing resin to the polyfunctional epoxy group-containing oligomer is 100:(5-40). Other steps are the same as in the first embodiment.
specific Embodiment approach 3
[0039] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the resin containing difunctional epoxy groups is alicyclic epoxy resin, diester chain alicyclic epoxy Resin, aliphatic epoxy resin, bisphenol A epoxy resin and hydrogenated bisphenol A epoxy resin or a mixture of several thereof; the alicyclic epoxy resin is 3,4-epoxy ring Hexylmethyl 3,4-epoxycyclohexyl carboxylate; diester chain aliphatic epoxy bis((3,4-epoxycyclohexyl)methyl)adipate; aliphatic epoxy resin For ethylene glycol diglycidyl ether. Other steps are the same as those in Embodiment 1 or 2.
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