Active thermoelectric cooling system for electronic device in severe working conditions
An electronic device, thermoelectric cooling technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problem that the thermoelectric module cannot work efficiently, there is no hot end cooling device, etc., to achieve effective heat dissipation, flexible reliability, and improved performance.
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[0040] This embodiment provides an active thermoelectric cooling system for electronic devices under harsh working conditions, including a thermoelectric module assembly, a temperature control assembly, and a passive heat dissipation assembly for dissipating heat from the hot end of the thermoelectric module assembly. Wherein: the cold end of the thermoelectric module assembly (refrigerating sheet) is connected to the heat generating part of the electronic device (the object to be cooled), so as to dissipate heat for the electronic device and realize active cooling of the electronic device. The cold end of the thermoelectric module assembly is close to the heating place of the electronic device, that is, the cooling object; the thermoelectric module assembly and the temperature control assembly are in a loop; The power of the refrigerating sheet of the thermoelectric module assembly is to effectively control the temperature of the electronic device and to lower the temperature ...
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