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Release film for green sheet production

A technology for printed circuit boards and peel-off films, which is applied in the direction of manufacturing tools, film/sheet adhesives, and synthetic resin layered products. Excellent performance and lower resistance value

Active Publication Date: 2015-11-25
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when a printed circuit board is manufactured using a release film, there is a problem that pinholes are generated on the printed circuit board due to the attached foreign matter, etc.

Method used

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  • Release film for green sheet production
  • Release film for green sheet production
  • Release film for green sheet production

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0145] First, a biaxially stretched polyethylene terephthalate film (thickness: 31 μm, arithmetic mean roughness Ra of the first surface) was prepared as a base material. 0 : 29nm, the maximum protrusion height Rp of the first surface 0 : 257nm, the arithmetic mean roughness Ra of the second surface 2 : 29nm, the maximum protrusion height Rp of the second surface 2 : 257nm).

[0146] Then, 94.05% by mass of dipentaerythritol hexaacrylate (solid content 100% by mass) as the active energy ray-curable compound (A) was diluted with a mixed solvent of isopropanol / methyl ethyl ketone (mass ratio 3 / 1) to obtain Polyorganosiloxane (B) 0.95% by mass of polyether-modified acryloyl group-containing polydimethylsiloxane (manufactured by Big Chemical Co., Ltd., product name "BYK-3500", solid content: 100% by mass), as carbon nano 0.24 parts by mass of multilayered carbon nanotubes (manufactured by Filgen Co., Ltd., product name "F-M-ML-1 / 25", fiber diameter about 10 nm, aspect ratio 500...

Embodiment 2、3

[0149] Except having changed the thickness of the release agent layer to what is shown in Table 1, it carried out similarly to Example 1, and produced the release film for printed circuit board manufacture.

Embodiment 4

[0151] Except that the mass ratio of the active energy ray-curable compound (A) and the polyorganosiloxane (B) in the release agent layer forming material was changed to that shown in Table 1, a release agent was obtained in the same manner as in Example 1. membrane.

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Abstract

Provided is a release film for green sheet production that comprises a substrate and a release agent layer. The release agent layer is formed by applying a material for release agent layer formation that contains an active energy ray-curable compound (A) comprising at least one reactive functional group that is selected from the group consisting of a (meth)acryloyl group, an alkenyl group, and a maleimide group, a polyorganosiloxane (B), and a carbon nanomaterial (C) to a first surface and irradiating the coating layer that is thereby formed with active energy rays. The release film for green sheet production is characterized in that the arithmetic average roughness (Ra1) of the outer surface of the release agent layer is 8 nm or less and the maximum protrusion height (Rp1) of the outer surface of the release agent layer is 50 nm or less. The present invention makes it possible to provide a release film for green sheet production that prevents the occurrence of pinholes, localized variation in thickness, or the like in the surface of a green sheet and that makes it possible to produce a highly reliable green sheet.

Description

technical field [0001] This invention relates to the peeling film for printed circuit board manufacture. Background technique [0002] In the manufacture of ceramic capacitors, a release film for green sheet manufacturing is used in order to form a green sheet. [0003] A release film generally consists of a substrate and a release agent layer. A printed circuit board is produced by applying a ceramic slurry obtained by dispersing and dissolving ceramic particles and a binder resin in an organic solvent on such a release film, and drying the slurry. And the manufactured printed circuit board was peeled from the release film, and it used for manufacture of a ceramic capacitor. [0004] In the production of a printed circuit board using a conventional release film, there have been problems such as the occurrence of pinholes on the surface of the printed circuit board due to the transfer of unevenness on the surface of the release film to the printed circuit board. [0005] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28B1/30B32B27/00B32B27/30
CPCC09J7/0228B28B1/30C09D135/02C09J2205/31C09J2433/005C09J7/401C09J2301/416C08F222/106C08F230/08
Inventor 深谷知巳市川慎也
Owner LINTEC CORP
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