Method for reducing damage of substrate material by high-energy particle bombardment
A technology of high-energy ions and substrates, used in the manufacture of discharge tubes, electrical components, semiconductor/solid-state devices, etc., to reduce damage
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0021] figure 1 It is a power application method of pulse modulation substrate bias RF power source. Which includes a plasma discharge chamber 1, a discharge coil 2, a quartz window 3, a substrate table 4, an air inlet 5 and an air outlet 6; also includes a radio frequency power source A applied to the discharge coil 2 and placed on the radio frequency The matching network A between the power source A and the discharge coil 2; also includes the RF power source B applied to the substrate stage 4, the RF power source B is connected to the substrate stage 4 through the matching network B, and the RF power source B is modulated by the pulse signal generated by the pulse signal transmitter B.
[0022] figure 2 It is another power application method for pulse modulating the substrate bias RF power source. Which includes a plasma discharge chamber 1, a discharge coil 2, a quartz window 3, a substrate table 4, an air inlet 5 and an air outlet 6; also includes a radio frequency pow...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com