Method of recovering tsk series probe station map by using test data

Abstract

The present invention relates to a method for recovering TSK series probe station MAP by using test data, which comprises the following steps: step 1, generating a recovery reference map corresponding to the test data according to the test data; step 2, according to the Complete the MAP diagram of the complete test to adjust the restoration reference diagram generated above, and restore the reference diagram to form an adjustment restoration diagram after adjustment; Step 3, utilize the adjustment restoration diagram after setting the die test attribute to generate a restoration MAP diagram; Step 4, when When the XY coordinates of the die in the restored MAP map are consistent with the XY coordinates of the die in the restored reference map, it is determined that the restoration of the MAP map according to the test data is successful; otherwise, adjust the XY coordinates of the die in the test data and repeat the above steps until it is determined The MAP is successfully restored based on the test data. The invention avoids the repeated testing of wafers, greatly reduces the possible quality risk caused by repeated testing, can meet the strict testing requirements of some special industries, and is safe and reliable.

Description

technical field [0001] The invention relates to a method, in particular to a method for recovering MAP of a TSK series probe station by using test data, and belongs to the technical field of wafer testing. Background technique [0002] For integrated circuit chip-level testing, domestic mainstream test foundries basically use TSK series probe stations on a large scale. The stability and software code openness of TSK series probe stations have a good reputation in the industry. But no matter how good the equipment is in the actual production process, the test MAP will be lost due to various unexpected factors. Among them, the unexpected factors that cause the loss of the test MAP are: the failure of the test system and the GPIB communication of the probe station causes the probe station to restart, the power supply Sudden power failure of the system, human misoperation caused the wafer to be ejected directly, or the hardware failure of the probe station directly restarted, et...

AI Technical Summary

Problems solved by technology

[0004] At present, the conventional way for test foundries to deal with the loss of probe station MAP is to test again and control the stitches as carefully as possible. Round size (≥12 inches), small area (≤0.25mm 2 ), small PADs (≤45um*45um), etc. have gradually become mainstream, wafer manufacturing costs and testing risks have increased significantly, and re-testing is often faced with economic compensation far exceeding test profits