High-thermal conductivity high-molecular composite material

Abstract

The invention relates to a high-thermal conductivity high-molecular composite material, which comprises the following raw materials by weight fraction: 35-45 parts of resin matrix, 60-75 parts of heat conduction filling material, 1-10 parts of toughening filling material, 0.3-1.3 parts of anti-oxidant and 0.5-4 parts of dispersant. The pretreated raw materials are performed with melting mixing through high-molecular material processing equipment to finish the granulation. The highest heat conduction coefficient of a final product is greater than 5.2W / m.K, and flame retardation performance and insulating property are excellent, and mechanical property is good. The raw material source is wide, cost is low, and the preparation steps are simple. The prepared preparation composite material has excellent heat conduction performance, insulating property, flame resistance and mechanical property, and can be widely used in the fields of a heat exchanger, an instrument case, an automobile, a chemical energy and an aviation spaceflight.

Description

technical field [0001] The invention belongs to the field of polymer composite material preparation, and in particular relates to a high thermal conductivity polymer composite material. Background technique [0002] Polymer-based composites have been widely used due to their light weight, easy processing, wear resistance, simple preparation, and easy industrialization. However, the thermal conductivity of most polymer materials is extremely low. If a certain thermal conductivity is endowed to polymer materials, the application fields of polymer materials can be greatly expanded. If the insulation performance of the polymer composite material is guaranteed on the basis of a certain thermal conductivity, it will have great positive significance for improving the accuracy and life of electrical and microelectronic devices and solving the needs of a large number of insulation and heat dissipation applications in reality. [0003] Generally speaking, in order to obtain higher th...

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Problems solved by technology

[0003] Generally speaking, in order to obtain higher thermal conductivity, the filling fraction of thermally conductive fillers is often higher, which will lead to a significant decrease in the toughness of the composite material and lose its practical value.

On the other hand, as plastic products are more and more widely used in life, flammability has become the biggest drawback of plastic products