Release film for manufacturing printed circuit board and method for producing release film for manufacture of printed circuit board

A technology for printed circuit substrates and peeling films, applied in the directions of manufacturing tools, chemical instruments and methods, applications, etc., can solve problems such as difficulty in obtaining reliable printed circuit substrates, and achieve failure prevention, high manufacturing reliability, and pinhole prevention. or the effect of local uneven thickness

Active Publication Date: 2017-09-05
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the conventional release film for producing printed circuit boards, if a thin printed circuit board is to be produced, pinholes, etc. are formed on the surface of the printed circuit board, and it is difficult to obtain a highly reliable printed circuit board.

Method used

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  • Release film for manufacturing printed circuit board and method for producing release film for manufacture of printed circuit board
  • Release film for manufacturing printed circuit board and method for producing release film for manufacture of printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0150] First, prepare a biaxially stretched polyethylene terephthalate film [thickness: 38 μm, arithmetic average roughness Ra of the first surface] as a base material 2 : 42nm, the maximum protrusion height Rp of the first surface 2 : 619nm, the arithmetic mean roughness Ra of the second surface 3 : 42nm, the maximum protrusion height Rp of the second surface 3 : 619nm].

[0151] Then, an ultraviolet-curable compound [manufactured by Arakawa Chemical Industry Co., Ltd., trade name "Bi-Mset 575CB"] mainly composed of urethane acrylate oligomer as an active energy ray-curable compound, 100% by mass of solid content, Mass average molecular weight 470, containing photoinitiator] 100 mass parts, and toluene, methyl ethyl ketone were mixed, and the composition for smoothing layer formation of 20 mass % of solid content was obtained.

[0152] The obtained composition for smoothing layer formation was apply|coated on the 1st surface of a base material with the No. 4 Meyer bar, and...

Embodiment 2

[0156] Except that the biaxially stretched polyethylene terephthalate film of Example 1 was converted into a biaxially stretched polyethylene terephthalate film [thickness: 31 μm, arithmetic mean roughness of the first surface Degree Ra 2 : 29nm, the maximum protrusion height Rp of the first surface 2 : 257nm, the arithmetic mean roughness Ra of the second surface 3 : 29nm, the maximum protrusion height Rp of the second surface 3 : 257 nm], a release film for printed circuit board manufacture was obtained in the same manner as in Example 1.

Embodiment 3

[0158] Except that the biaxially stretched polyethylene terephthalate film of Example 1 was converted into a biaxially stretched polyethylene terephthalate film [thickness: 31 μm, arithmetic mean roughness of the first surface Degree Ra 2 : 15nm, the maximum protrusion height Rp of the first surface 2 : 98nm, the arithmetic mean roughness Ra of the second surface 3 : 15nm, the maximum protrusion height Rp of the second surface 3 : 98 nm], except that the thickness of the smoothing layer was changed to 0.4 μm, a release film for printed circuit board production was obtained in the same manner as in Example 1.

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Abstract

The peeling film for printed circuit board manufacture of the present invention is characterized in that it includes a base material having a first surface and a second surface, a smoothing layer provided on the first surface of the base material, and The release agent layer provided on the opposite side of the substrate forms a smoothing layer by irradiating an active energy ray-curable composition for forming a smoothing layer containing an active energy ray-curable compound and curing it. The arithmetic mean roughness Ra1 of the outer surface is 8 nm or less, and the maximum protrusion height Rp1 of the outer surface of the release agent layer is 50 nm or less. According to this invention, the release film for printed circuit board manufacture which can prevent a pinhole etc. from being produced on the surface of a printed circuit board and can manufacture a highly reliable printed circuit board can be provided.

Description

technical field [0001] This invention relates to the manufacturing method of the release film for printed circuit board manufacture, and the release film for printed circuit board manufacture. Background technique [0002] In the manufacture of ceramic capacitors, a release film for green sheet manufacturing is used in order to form a green sheet. [0003] The release film for printed circuit board manufacture is generally comprised from a base material and a release agent layer. A printed circuit board is produced by applying a ceramic slurry obtained by dispersing and dissolving ceramic particles and a binder resin in an organic solvent on such a release film for producing a printed circuit board, and drying it. And the manufactured printed circuit board was peeled from the release film for printed circuit board manufacture, and it used for manufacture of a ceramic capacitor. [0004] In the conventional production of printed circuit boards using the release film for pri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/16
CPCB28B1/30B32B27/16B32B7/06B32B27/08B32B2307/538B32B2307/748B32B2457/16
Inventor 深谷知巳市川慎也
Owner LINTEC CORP
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