Double-degree-of-freedom active vibration reducing device and control method

Abstract

The invention provides a double-degree-of-freedom active vibration reducing device and a control method; a flexible structure can decouple vibrations in vertical and horizontal directions, and uses a vibration reducing control algorithm for realizing active vibration reducing control to achieve the vibration requirement of nanoscale machining equipment; the mechanism using the active vibration reducing device and the control algorithm can achieve a vibration reducing effect with the vibration amplitude of 10-20 dB; the influence of the vibration on the dynamic performance of a lithography machine is preferably reduced; the imaging quality of a projection objective lens is guaranteed; and the precision of a photolithography process is improved.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a dual-degree-of-freedom active damping device and a control method. Background technique [0002] With the development of large-scale integrated circuit manufacturing, nano-processing equipment represented by lithography machines integrates cutting-edge technologies in multiple disciplines such as optics, mechanics, and electricity, and represents the highest achievement of advanced manufacturing technology. Since nano-processing equipment represented by lithography machines involves nano-exposure, positioning and measurement, it has strict requirements on environmental control of vibration, temperature, humidity and particles, and vibration reduction technology is one of the key technologies. Early lithography machines and precision processing equipment used passive vibration reduction systems. The vibration reduction components include metal springs, rubber and ...

AI Technical Summary

Problems solved by technology

These vibration damping systems are simple in structure and easy to implement. The disadvantage is that once the design is completed, its parameters are difficult to change, so it can only attenuate the vibration of a specific narrow frequency band. It is not suitable for occasions with strong denaturation; at the same time, due to the limitation of stability, passive vibration isolation cannot attenuate low-frequency vibrations

Although a flexible hinge structure is added in the design, this cannot inhibit the effect of tangential force on the piezoelectric ceramic block. Long-term exposure of the piezoelectric ceramic block to the tangential force will reduce its service life, and even damage it in severe cases. When the isolated equipment is subjected to horizontal and vertical vibrations at the same time, this structure cannot achieve decoupling control, and the vertical and horizontal vibration damping controls affect each other

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