Organopolysiloxane composition used for packaging light-emitting diode

A technology of light-emitting diodes and polysiloxanes, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of waste products, easy separation of packaging materials and shells, and unsatisfactory adhesion of polyphthalamide. Achieve cost reduction, excellent bonding effect, and improve the effect of low bonding strength

Active Publication Date: 2015-11-04
TECORE SYNCHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, traditional tackifiers are mostly silane coupling agents or simple adducts of hydrogen-containing rings and allyl glycidyl ether, which are not ideal for bonding polyphthalamide (PPA) to metals, especially in During the reflow soldering process, the packaging material and the shell are easy to separate, resulting in waste products

Method used

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  • Organopolysiloxane composition used for packaging light-emitting diode

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Preparation of epoxy-containing phenyl vinyl polysiloxane:

[0026] Under the catalysis of anion exchange resin D296R, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane and diphenylsilane The diol was condensed at 70°C for 8 hours, then reduced to 100°C / 0.096MPa to remove low boilers, filtered to remove the anion exchange resin, and obtained epoxy-containing phenyl vinyl polysiloxane; 2-( 3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane and diphenylsilanediol are represented by a, b and c in sequence, and the The molar ratio of a:b:c=3:0.5:4, a+b=3.5.

Embodiment 2

[0028] Preparation of epoxy-containing phenyl vinyl polysiloxane:

[0029] Under the catalysis of anion exchange resin D296R, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, acryloyloxypropyltrimethoxysilane and diphenylsilanediol were 50°C, condensation reaction for 12 hours, then remove low boilers under reduced pressure at 100°C / 0.096MPa, filter to remove anion exchange resin, and obtain epoxy-containing phenyl vinyl polysiloxane; 2-(3,4 -Epoxycyclohexyl)ethyltriethoxysilane, acryloxypropyltrimethoxysilane, and diphenylsilanediol are represented by a, b, and c in turn, and the a:b:c The molar ratio of =2:2:4, a+b=4.

Embodiment 3

[0031] Preparation of epoxy-containing phenyl vinyl polysiloxane:

[0032] Under the catalysis of anion exchange resin D296R, 3-(2,3-glycidoxy)propyltriethoxysilane, methacryloxypropyltriethoxysilane and diphenylsilanediol Condensation reaction at 25°C for 15 hours, then remove low boilers under reduced pressure at 100°C / 0.096MPa, remove anion exchange resin by filtration, and obtain epoxy-containing phenyl vinyl polysiloxane; 3-(2, 3-glycidoxy)propyltriethoxysilane, methacryloxypropyltriethoxysilane and diphenylsilanediol are represented by a, b and c successively, and the a:b: The molar ratio of c=0.5:3:4, a+b=3.5.

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Abstract

The invention discloses an organopolysiloxane composition used for packaging a light-emitting diode. The composition is composed of a component A and a component B. The component A is manufactured through the steps of stirring vinyl phenyl polysiloxane and vinyl phenyl silicone soil uniformly, adding a karstedt platinum catalyst and stirring the mixture uniformly; the component B is manufactured through the steps of stirring hydrogen-contained phenyl polysiloxane, heptamethyltrisiloxane and phenyl vinyl polysiloxane containing an epoxy group uniformly, adding an inhibitor and tackifier and stirring the mixture uniformly. The reaction process is easy to control, and the organopolysiloxane composition is economical and environmentally friendly, and adapts to large-scale mass production; meanwhile, without containing inorganic ions, the composition has an excellent insulating property; as anion exchange resin is adopted as a catalyst, the after-treatment process is simple, the composition can be reused, cost is reduced, and environment can be protected easily. The refraction coefficient of the composition is 1.541-1.545, and hardness and flexibility are moderate.

Description

technical field [0001] The invention relates to an organopolysiloxane composition for packaging high-refraction and high-adhesion high-power light-emitting diodes and a preparation method. Background technique [0002] Semiconductor lighting technology is one of the most promising high-tech fields in the 21st century, and Light Emitting Diode (hereinafter referred to as LED) is its core technology. LED is a kind of light-emitting element that can directly convert electric energy into light energy. It has low working voltage, low power consumption, high luminous efficiency, extremely short luminous response time, pure light color, firm structure, impact resistance and vibration resistance. , stable and reliable performance, light weight, small size and low cost, and a series of characteristics, so it has been widely used and developed by leaps and bounds. [0003] With the continuous improvement of power white LED manufacturing technology, its luminous efficiency, brightness...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/06H01L33/56C08G77/20C08G77/14C08G77/08
Inventor 谭晓华冯亚凯赵苗孙绪筠
Owner TECORE SYNCHEM
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