Sub module of power semiconductor device
A technology of power semiconductors and sub-modules, which is applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve problems such as easy wear of chips, unfavorable use, dislocation of chip plates, etc., and achieve normal electrical connection , Prevent wear, improve production qualification rate and service life
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[0024] The present invention will be further described below in conjunction with accompanying drawing.
[0025] figure 1 The specific structure of the power semiconductor device sub-module 1 of the present invention is schematically shown. The power semiconductor device sub-module 1 includes a conductive component and a clamping component, and the conductive component is accommodated in the clamping component. The conductive component includes a first conductor 21 , a chip 23 and a second conductor 22 stacked in sequence, that is, the chip 23 is disposed between the first conductor 21 and the second conductor 22 . Both the first conductor and the second conductor can be pole plates or other conductive structures (for example, a molybdenum sheet with a certain thickness is usually used as the conductor). The first conductor 21 can be an emitter, and the second conductor 22 can be a collector. The clamping assembly can clamp the first conductor 21 and the second conductor 22,...
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