Transparent conductive film and capacitive touch screen including it
A technology of transparent conductive film and transparent substrate, which is applied in the direction of electrical digital data processing, input/output process of data processing, instruments, etc., can solve the problem of serious three-dimensional lines, achieve the relief of serious three-dimensional lines, reduce stress differences, Effect of Stress Difference Reduction
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Embodiment 1
[0039] The surface of the transparent base material layer 30 is coated with a hardening solution of the type FZ001 selected from Japan Arakawa Chemical Co., Ltd., dried and cured to form the first hardened layer 10 . Then, in the same manner, the surface of the transparent substrate layer 30 far away from the first hardened layer 10 is coated with a hardening solution selected from the Japanese DIC company with a model number of PC13-1082 to form the second hardened layer 50 .
[0040] Utilize the magnetron sputtering process, on the surface of the second hardened layer 50 away from the above-mentioned transparent substrate layer 30, a film is coated to obtain an amorphous ITO layer, forming figure 1 The transparent conductive film shown.
[0041] The amorphous ITO layer 70 of the transparent conductive film was etched by an ink screen printing etching method, and then baked at a temperature of 150° C. for 60 minutes. The specific structural parameters of the transparent cond...
Embodiment 2
[0043] Adopt the method identical with embodiment 1 to prepare figure 1 The transparent conductive film shown, the structural parameters of the prepared transparent conductive film are shown in Table 1, wherein, the hardening solution for coating the first hardening layer 10 is the hardening solution of FZ001 of Japan Arakawa Chemical Co., Ltd., and the second hardening solution for coating is FZ001. The hardening liquid of layer 50 is the hardening liquid of the model number KZ6661 of JSR Company of Japan. The specific structural parameters of the transparent conductive film are shown in Table 1.
Embodiment 3
[0045] Adopt the method identical with embodiment 1 to prepare figure 1 The transparent conductive film shown, the structural parameters of the prepared transparent conductive film are shown in Table 1, wherein, the hardening solution for coating the first hardening layer 10 is the hardening solution of FZ001 of Japan Arakawa Chemical Co., Ltd., and the second hardening solution for coating is FZ001. The hardening liquid of layer 50 is the hardening liquid of model KZ6661 of Japanese JSR company, forms figure 1 The transparent conductive film shown. The specific structural parameters of the transparent conductive film are shown in Table 1.
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