Method for manufacturing flexible substrate and substrate structure
A flexible substrate and flexible technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of high cost of coating raw materials and peeling methods, damage to the internal structure of flexible substrates, and high stress on flexible substrates. Achieve the effect of low raw material cost and operating cost, ensure stability, and avoid offset
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[0034] The present invention will be further described below in conjunction with accompanying drawing.
[0035] figure 1 The structure of substrate structure 1 is shown. Such as figure 1 As shown, the substrate structure 1 includes a flexible motherboard 2 , a rigid motherboard 3 and an adhesive layer 4 . Wherein, the flexible motherboard 2 has a first active area 5 forming a flexible substrate and a first non-active area 6 located on the periphery of the first active area 5 . exist figure 1 In , the dotted line represents the boundary line between the first active area 5 and the first inactive area 6 . Correspondingly, the rigid motherboard 3 has a second active area 7 and a second inactive area 8, and the second active area 7 corresponds to the first active area 5, and the second inactive area 8 corresponds to the first inactive area 8. Similarly, the dotted line represents the boundary line between the second active area 7 and the second non-active area 8 . The adhes...
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