Imitation gold electroplating solution

Abstract

The invention discloses an imitation gold electroplating solution which is composed of the following raw materials: 80-85 parts of cuprous sulfate, 80-90 parts of cupric chloride, 10-15 parts of sodium cyanide, 10-12 parts of ammonium thiocyanate, 8-10 parts of potassium thiocyanate, 20-30 parts of potassium cyanide, 40-45 parts of potassium auric cyanide, 8-10 parts of zinc hydroxide, 15-20 parts of barium cyanide, 20-25 parts of calcium cyanide, 15-20 parts of silver cyanide, 5-6 parts of trisodium phosphate, 5-8 parts of sodium metaphosphate, 8-10 parts of citric acid, 8-10 parts of magnesium fluoride, 8-10 parts of barium fluoride, 6-10 parts of sodium fluosilicate and 8-10 parts of aluminum fluoride. The imitation gold electroplating solution has the advantages of low cost, high electroplating performance, wide raw material sources, simple preparation process, stable performance and favorable electroplating effect.

Description

technical field [0001] The invention relates to the technical field of an electroplating solution, in particular to an imitation gold electroplating solution. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface made of metal or other materials to prevent corrosion and improve resistance. Abrasive, conductive, reflective and aesthetically pleasing. [0003] The blanks of parts used for electrical contacts such as connecting machines used in electronic equipment are generally made of copper-based blanks such as phosphor bronze or beryllium; electroplating technology is widely used in the surface treatment of parts for electrical contacts, and the types can be roughly divided into Plating for precious or base metals. [0004] The base metal plating widely used in the...

AI Technical Summary

Problems solved by technology

However, as the harmfulness of lead was pointed out, lead-free plating was used instead of lead plating. A typical method is to perform nickel plating on copper-based blanks of electrical contact parts, followed by tin or tin alloy plating, Since metal cannot avoid the occurrence of defective electronic circuits, tin plating is prone to problems such as high contact resistance and low corrosion resistance