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Electroplating liquid for electroplating treatment

A technology for electroplating treatment and electroplating solution, applied in the field of electroplating solution for electroplating treatment, can solve problems such as damage to appearance, increase in contact resistance, deterioration of brazing performance, etc., and achieve the effects of low power consumption, prevention of diffusion, and improvement of service life

Inactive Publication Date: 2015-09-16
黄惠娟
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, when silver plating is performed, although the silver layer has strong anti-corrosion properties, the surface of the silver-plated copper wire is easy to react with sulfides and halides in the air when exposed to the air for a long time, causing the overall surface to change color. , not only destroys the appearance, but also increases the contact resistance and deteriorates the brazing performance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] An electroplating solution for electroplating treatment described in this embodiment 1 is composed of the following raw material components: 20 parts of nickel oxide, 15 parts of zinc sulfate, 10 parts of aluminum sulfate, 13 parts of stannous sulfate, 10 parts of manganese sulfate , 3 parts 1,4-bis(phenylethynyl)benzene, 3 parts diphenyl propargyl ether, 2 parts sodium benzoate, 10 parts oxalic acid, 8 parts potassium fluoroborate, 6 parts potassium fluorotitanate, 5 parts Parts Hydrofluoric Acid, 5 Parts Sodium Fluorosilicate, 3 Parts Lead Acetate, 10 Parts Cobalt Acetate, 10 Parts Zinc Acetate, 10 Parts Ethylene Glycol Monomethyl Ether, 3 Parts Triethylene Glycol, 2 Parts Sodium Tripolyphosphate, 3 Parts Sodium hexametaphosphate, 3 parts sodium pyrophosphate, 8 parts silicone oil.

Embodiment 2

[0012] An electroplating solution for electroplating treatment described in this embodiment 2 consists of the following raw material components: 25 parts of nickel oxide, 20 parts of zinc sulfate, 12 parts of aluminum sulfate, 15 parts of stannous sulfate, 12 parts of manganese sulfate , 5 parts 1,4-bis(phenylethynyl)benzene, 4 parts diphenyl propargyl ether, 3 parts sodium benzoate, 20 parts oxalic acid, 10 parts potassium fluoroborate, 8 parts potassium fluorotitanate, 6 parts Parts Hydrofluoric Acid, 8 Parts Sodium Fluorosilicate, 5 Parts Lead Acetate, 15 Parts Cobalt Acetate, 12 Parts Zinc Acetate, 15 Parts Ethylene Glycol Monomethyl Ether, 5 Parts Triethylene Glycol, 4 Parts Sodium Tripolyphosphate, 5 Parts Sodium hexametaphosphate, 5 parts sodium pyrophosphate, 10 parts silicone oil.

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PUM

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Abstract

The invention discloses an electroplating liquid for an electroplating treatment. The electroplating liquid is prepared from the following raw material components in parts: 20-25 parts of nickel oxide, 15-20 parts of zinc sulphate, 10-12 parts of aluminium sulphate, 13-15 parts of stannous sulphate, 10-12 parts of manganese sulphate, 3-5 parts of 1,4-bis(phenylacetenyl) benzene, 3-4 parts of dipolyphenyl propargyl ether, 2-3 parts of sodium benzoate, 10-20 parts of oxalic acid, 8-10 parts of potassium fluoborate, 6-8 parts of potassium fluotitanate, 5-6 parts of hydrofluoric acid, 5-8 parts of sodium fluosilicate, 3-5 parts of lead acetate, 10-15 parts of cobalt acetate, 10-12 parts of zinc acetate, 10-15 parts of ethylene glycol monomethyl ether, 3-5 parts of triethylene glycol, 2-4 parts of sodium tripolyphosphate, 3-5 parts of sodium hexametaphosphate, 3-5 parts of sodium pyrophosphate and 8-10 parts of silicone oil. The electroplating liquid for the electroplating treatment is good in corrosion resistance and wear resistance, capable of effectively preventing copper atoms from diffusing to an electrolyte during a use process and reducing waste, fast in precipitation speed, wide in current density range, low in electric energy consumption, good in electroplating quality, and capable of prolonging the service lives of metal copper wires.

Description

technical field [0001] The present invention relates to the technical field of electroplating solutions, in particular to an electroplating solution for electroplating treatment. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. Grinding, electrical conductivity, reflective and enhancing aesthetics and other functions. [0003] At present, when silver plating is carried out, although the silver layer has strong corrosion resistance, the surface of silver-plated copper wire is easy to interact with sulfides and halides in the air when exposed to the air for a long time, causing overall discoloration of the surface. , not only destroys the appearance, but also increases the contact resistance and deteriorates the brazing performance. The essence of the discoloration of the silver-plated layer is surface ionization. If the purity of the silver-plat...

Claims

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Application Information

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IPC IPC(8): C25D3/02
Inventor 黄惠娟
Owner 黄惠娟
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