Copper oxide making method and copper oxide making equipment

Abstract

The invention provides a copper oxide making method and copper oxide making equipment. The copper oxide making method includes the steps of: placing a solid copper material into a dissolving tank, and carrying out initial reaction in an environment containing 100-150g/L ammonia solution, 60-110g/L carbon dioxide, pure water and air to generate a cuprammonium solution with a copper content of 90-140g/L, in the reaction process, further refluxing the unreacted gas into the dissolving tank by a reflux unit and a circulation device, and carrying out the initial reaction again; taking 125-143DEG C steam to carry out ammonia distillation reaction on the cuprammonium solution to form basic cupric carbonate and a mixed gas, further recovering the mixed gas into the dissolving tank by the circulation device and carrying out the initial reaction again; conducting a solid-liquid separation step to separate the basic cupric carbonate; and calcining the separated basic cupric carbonate for 1-4h at 250-600DEG C so as to form copper oxide.

Description

technical field [0001] The invention relates to a copper oxide manufacturing process technology, in particular to a copper oxide manufacturing method and equipment thereof with simple manufacturing process and greatly reduced production cost. Background technique [0002] Press, as consumer electronics products tend to be thinner and multi-functional, the design of printed circuit boards is also complicated, prompting the use of high-density interconnect technology (High Density Interconnect, HDI) to make circuits with high-density wiring and micro-holes Board demand has increased significantly. However, the manufacturing difficulty and cost of HDI circuit boards are relatively high. Therefore, in order to prepare the copper oxide required for electroplating and filling holes, in addition to having high purity and high activity to ensure the concentration and dissolution rate of copper ions in the electroplating solution, how to reduce oxidation? The production cost of copp...

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Problems solved by technology

However, the manufacturing difficulty and cost of HDI circuit boards are relatively high. Therefore, in order to prepare the copper oxide required for electroplating and filling holes, in addition to having high purity and high activity to ensure the concentration and dissolution rate of copper ions in the electroplating solution, how to reduce oxidation? The production cost of copper has become one of the important technologies in the printed circuit board industry

[0003] Generally speaking, the method for preparing highly active copper oxide is as disclosed in Chinese Patent No. 1335264A. It prepares a copper sulfate solution, puts it in a reactor and feeds it with air, oxidizes at a low temperature of 80-85°C and cools to form copper sulfate crystals. , and then react with potassium hydroxide aqueous solution to generate

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