Plastic packaging type IPM lead wire framework injection moulding guider

Abstract

The invention discloses a plastic packaging type IPM lead wire framework injection moulding guider, which is an injection moulding channel arranged on a lead wire framework. A deceleration shunting mechanism is arranged in the injection moulding channel and comprises at least one hollow out aperture. In the guider, by arranging the hollow out aperture in the injection moulding channel of the lead wire framework for deceleration shunting, when injection moulding material flows through the injection moulding channel, the structure of the hollow out aperture may generate the corresponding block effect on the injection moulding material and reduce the flow velocity to a certain extent. The injection moulding material can be divided to form two conveying channels arranged on upside and downside of the lead wire framework. In this way, the injection moulding material can be fully injected into a tool, the generation amount of bubbles in the injection molding body can be effectively reduced, the insulation characteristic of products is raised, the stability and reliability of the products are improved, and the product quality is effectively improved while rapid injection moulding is maintained, and the production efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of production and manufacture of plastic-encapsulated IPM modules, in particular to a plastic-encapsulated IPM lead frame injection guiding device. Background technique [0002] Plastic-encapsulated IPM (Intelligent Power Module) is a new type of control module that integrates IGBT chip, its drive circuit, control circuit, and protection circuits for overcurrent, undervoltage, short circuit, and overheating. It is a complex and advanced power module that can automatically realize complex protection functions such as overcurrent, undervoltage, short circuit and overheating, so it has intelligent features. At the same time, it has the advantages of low cost, miniaturization, high reliability and easy use, etc. It is widely used in variable frequency household appliances, inverter power supply, industrial control and other fields, with considerable social and economic benefits. [0003] For plastic-encapsulate...

AI Technical Summary

Problems solved by technology

[0004] At present, the injection molding process used in the mass production of plastic-encapsulated IPM modules is to inject through a large gap in the lead frame, which can ensure that a large amount of epoxy can flow into the fixture, but if the flow rate is too fast Bubbles and cavities will be formed, which will have a great impact on the quality of the module

like figure 2 As shown, the dotted line box is the tooling of the injection molding module. If the flow rate of the injection molding is too fast, the epoxy glue will form a backflow when it rushes to the front tooling, which will cause the generation of air bubbles (A is the position where the air bubbles are generated). For power devices, Air bubbles and voids in the injection molding body will seriously affect the insulation properties of the product, and during long-term operation, the temperature of the power device is usually high, and the air bubbles will expand, which will cause the module to burst, which will seriously affect the reliability of the module

And for different products, the injection flow rate is difficult to grasp

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