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A method for manufacturing a rigid-flex circuit board with a flexible board on the outer layer

A technology of rigid-flexible combination and manufacturing method, which is applied in the secondary processing of printed circuits, coating non-metallic protective layers, and assembling printed circuits with electrical components, which can solve the problem of burrs, asymmetric structures, and difficult graphics on flexible boards. Transfer and other problems to achieve the effect of improving soft board burrs and increasing hardness

Active Publication Date: 2018-03-02
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is more difficult to process the rigid-flex board on the outer layer of the flexible board. The reasons are: first, the structure is asymmetrical, resulting in board bending; second, the flexible board is thin, and the corresponding non-flowing PP is windowed. The flexible board at the window opening position has a large drop, and it is not easy to complete the pattern transfer; third, the flexible board is on the outer layer and spreads over the entire hard board area. During mechanical molding, it is easy to generate burrs on the flexible board.

Method used

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  • A method for manufacturing a rigid-flex circuit board with a flexible board on the outer layer
  • A method for manufacturing a rigid-flex circuit board with a flexible board on the outer layer

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Embodiment

[0020] Such as figure 1 The shown rigid-flex circuit board includes a rigid board 1 and a flexible board 2 pressed on the surface of the rigid board 1 .

[0021] The method for manufacturing a rigid-flex circuit board includes the following steps in sequence: making a flexible board, making a rigid board, making an adhesive (PP with low fluidity), laminating a flexible board and a rigid board, making outer graphics, soldering, Mechanical forming.

[0022] The method of mechanical forming is as follows: the surface of the outer flexible board 2 is coated with solder resist ink, and the solder resist ink covers the surface of the flexible board 2, including the circuit copper layer 3 area and the non-circuit copper layer area 5, and the circuit copper layer on the surface of the flexible board The thickness of layer 3 is 35 μm; then bake the circuit board coated with solder resist ink at 150°C for 60 minutes, so that the solder resist ink forms a rigid film 7 with a film hardn...

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Abstract

The invention discloses a method for manufacturing a rigid-flex circuit board with a flexible board on the outer layer. The manufacturing method includes making flexible boards, making rigid boards, laminating flexible boards and rigid boards, making outer layers of graphics, soldering, and mechanical forming; the method of mechanical forming includes in sequence: The surface of the molding part is coated with ink; the circuit board is baked to make the ink form a rigid film; the surface of the flexible board is covered with a cover plate; The present invention covers and fills the flexible board that needs to be formed with silk screen solder resist ink, and solves the gap problem caused by the copper layer thickness difference between the copper layer area and the molding area on the surface of the flexible board; in addition, the solder resist ink has a certain hardness after solidification , can improve the hardness of the flexible board, and then use the cover plate and backing plate to cover both sides of the rigid-flexible circuit board, and shape it with a double-edged milling cutter, which can completely improve the problem of soft board burrs during molding.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a rigid-flex circuit board with a flexible board on the outer layer. Background technique [0002] There are many product structures of rigid-flex boards, among which the flexible board is the most common on the outer layer, one side is a rigid board and the other side is a flexible board. This design can reduce the bending angle of the flexible board and improve the bending angle of the flexible board. The folding length is widely used in the industry. It is more difficult to process the rigid-flex board on the outer layer of the flexible board. The reasons are: first, the structure is asymmetrical, resulting in board bending; second, the flexible board is thin, and the corresponding non-flowing PP is windowed. The flexible board at the window opening position has a large drop, which makes it difficult to complete the pattern transfer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36H05K3/28
Inventor 何淼莫颢君周长春刘东
Owner SHENZHEN SUNTAK MULTILAYER PCB
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