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A mems pressure sensor device and packaging method

A technology of pressure sensor and pressure-sensitive film, which is applied in measurement devices, microstructure devices, and manufacturing microstructure devices, etc., can solve problems such as the inability to use MEMS pressure sensors

Active Publication Date: 2017-04-12
苏州曼普拉斯传感科技有限公司
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Problems solved by technology

[0008] Another object of the present invention is to provide a MEMS pressure sensor device and a packaging method. By providing a vent hole at the bottom of the packaging substrate, the external atmosphere is in contact with the pressure-sensitive film to sense pressure, so that the MEMS pressure sensor realizes back pressure. Detects pressure, which solves the problem that users cannot use MEMS pressure sensors that sense pressure through the upper part

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  • A mems pressure sensor device and packaging method
  • A mems pressure sensor device and packaging method
  • A mems pressure sensor device and packaging method

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Embodiment Construction

[0045] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0046] figure 2 It is the first preferred embodiment of a MEMS pressure sensor device provided by the present invention. Such as figure 2 As shown, a MEMS pressure sensor device includes a MEMS pressure sensor 10, a packaging component 20, and an integrated circuit (such as an ASIC chip) 30, wherein the MEMS pressure sensor 10 is connected to the ASIC chip 30, and is mounted on The packaging component 20 is used to sense changes in air...

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Abstract

The present invention provides a MEMS pressure sensor device and packaging method, comprising an integrated circuit, a MEMS pressure sensor connected to the integrated circuit and a packaging component, the packaging component includes a substrate and a cover plate, the cover The board is connected to the substrate and forms an accommodating space, wherein the MEMS pressure sensor and the integrated circuit are connected to the substrate and located in the accommodating space, and the substrate has a vent hole through which the outside atmosphere passes. In contact with the MEMS pressure sensor, the MEMS pressure sensor device is adapted to sense ambient air pressure through its back.

Description

Technical field [0001] The invention belongs to the field of microelectronic mechanical systems (MEMS), and particularly relates to a MEMS pressure sensor device and a packaging method. Background technique [0002] Microelectromechanical Systems (MEMS) refers to a microelectromechanical system that integrates micro sensors, actuators, signal processing and control circuits, communications and power supplies. At present, MEMS as a pressure detection system has been widely used in various industries such as water conservancy, chemical industry, medical treatment, automotive electronics, consumer electronics, industrial electronics, etc., for example, engine oil pressure sensors in the field of automotive electronics, automotive brake system air pressure sensors, tire pressure Monitoring system pressure sensor, automobile engine intake manifold pressure sensor, diesel engine common rail pressure sensor, fuel distribution pipe sensor, seat comfort sensor, side impact sensor; tire pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L9/06B81B7/00B81C1/00
Inventor 谢勇
Owner 苏州曼普拉斯传感科技有限公司
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