Device for testing relevance between chip temperature and current intensity

A technology for testing equipment and current strength, applied in the field of testing the correlation between chip temperature and current strength, can solve the problems of high cost, high error rate, low efficiency, etc., and achieve the effect of improving accuracy and effectiveness and reducing errors

Inactive Publication Date: 2015-07-29
HANGZHOU SILAN MICROELECTRONICS
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] This manual measurement method is not only expensive, but also inefficient and has a high error rate

Method used

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  • Device for testing relevance between chip temperature and current intensity
  • Device for testing relevance between chip temperature and current intensity

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Embodiment Construction

[0032] The present invention is described below based on examples, but the present invention is not limited to these examples. In the following detailed description of the invention, some specific details are set forth in detail. The present invention can be fully understood by those skilled in the art without the description of these detailed parts. In order to avoid obscuring the essence of the present invention, well-known methods, procedures, and flow charts are not described in detail. Additionally, the drawings are not necessarily drawn to scale.

[0033] figure 1 is a structural diagram of the test equipment of the embodiment of the present invention. like figure 1 As shown, the testing device 10 of this embodiment includes a processor 100 , a temperature measuring device 101 , a current measuring device 102 , and a chip configuration device 103 . Wherein, the processor 100 is connected with the temperature measurement device 101 , the current measurement device 10...

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Abstract

The invention provides a device for testing the relevance between chip temperature (chip surface temperature) and current intensity. The temperature of a chip to be tested and current intensity on the key path of the chip can be rapidly and accurately measured through a temperature measuring device and a current measuring device, and the numerical values of the temperature of the chip to be tested and the current intensity of the chip can be saved in an internal storage unit of testing equipment in order to export data in batches at a later stage. By adopting the testing equipment, the chip temperature and the current intensity can be measured synchronously and automatically, so that errors caused by manual intervention are reduced, and the accuracy and the effectiveness of the measured data are increased. Moreover, a working mode of the chip is set, so that the working mode of the chip can be controlled effectively.

Description

technical field [0001] The invention relates to the field of chip testing, in particular to the testing of the correlation between the chip temperature and the current intensity of some high-integrated complex chips with medium and high power and large calorific value. Background technique [0002] With the advancement of semiconductor technology and packaging process size, the integration of chips is getting higher and higher, and an important challenge that comes with it is to reduce power consumption and temperature consumption as much as possible for such a highly integrated design process. , Improving the energy conversion efficiency is very difficult for the design of the chip. Accurately assessing the correlation between the temperature of the chip when it is working and the current intensity on the critical path of the chip is an important reference for reducing energy consumption and heat generation in the chip design stage, especially in the later verification stag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
Inventor 潘子升宋斌俊魏建中
Owner HANGZHOU SILAN MICROELECTRONICS
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