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Hot melt adhesive composition and preparation method thereof, and hot melt adhesive heat-conducting strip and preparation method thereof

A technology of hot melt adhesives and compositions, applied in the direction of acrylonitrile butadiene styrene polymer adhesives, adhesives, epoxy resin adhesives, etc., can solve problems such as flow and deformation of phase change interface materials, and achieve easy to overcome flowing effect

Active Publication Date: 2015-07-22
ZHEJIANG SAINTYEAR ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the general phase change material used as the interface material of electronic components, its phase change point should not be too high, generally around 50°C. This characteristic is a fatal flaw in the application process of this material, especially at the phase change interface. During the ocean transportation of materials, the ambient temperature often exceeds its phase transition point, which causes the phase transition interface material to flow and deform before it reaches the user's hands.

Method used

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  • Hot melt adhesive composition and preparation method thereof, and hot melt adhesive heat-conducting strip and preparation method thereof
  • Hot melt adhesive composition and preparation method thereof, and hot melt adhesive heat-conducting strip and preparation method thereof
  • Hot melt adhesive composition and preparation method thereof, and hot melt adhesive heat-conducting strip and preparation method thereof

Examples

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preparation example Construction

[0062] The embodiment of the present invention also provides a preparation method of the above-mentioned hot melt adhesive composition. Such as figure 1 Shown, the preparation method of above-mentioned hot-melt adhesive composition may further comprise the steps:

[0063] S11. Weigh the weight of each composition according to the predetermined composition and parts by weight:

[0064] Specifically, each component can be weighed according to the composition shown in Table 1 and its parts by weight.

[0065] S12. Mixing the thermoplastic resin and the tackifier at a temperature higher than the softening point of the thermoplastic resin for a first predetermined period of time, so that the thermoplastic resin and the tackifier form a homogeneous molten mixture:

[0066] It should be noted that the temperature higher than the softening point of the thermoplastic resin cannot be raised without limit. It is necessary to ensure that the thermoplastic resin and the tackifier can mel...

Embodiment 1

[0098] The composition and parts by weight of the hot-melt adhesive composition in embodiment 1 are as shown in table 4:

[0099] Table 4: Formulation of Example 1

[0100] composition

Weight (unit: Kg)

PET resin

2.5

EVA resin

5

Tackifier

0.5

Zinc oxide powder with a particle size of 0.5 microns

25

Zinc oxide powder with a particle size of 5 microns

15

Aluminum powder with a particle size of 30 microns

32

Aluminum powder with a particle size of 4 microns

20

[0101] The preparation method of the hot melt adhesive heat conducting sheet composed of the above components is as follows:

[0102] A, preparation of hot melt adhesive composition:

[0103] 1) Weigh 2.5 kg of PET resin, 5 kg of EVA resin and 0.5 kg of tackifier and mix them together for 15 minutes at 130±5°C to make them fully mixed;

[0104] Add 25 kg of zinc oxide powder with a particle size of 0.5 micron, continue to s...

Embodiment 2

[0112] The composition and parts by weight of the hot melt adhesive composition in embodiment 2 are as shown in table 5:

[0113] Table 5: Formulation of Example 2

[0114] composition

[0115] The preparation method of the hot melt adhesive heat conducting sheet described in Example 2 is the same as that in Example 1. For the sake of brevity, it will not be described in detail here. For details, refer to the detailed description of Example 1.

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Abstract

The invention provides a hot melt adhesive composition and a preparation method thereof and further provides a hot melt adhesive heat-conducting strip and a preparation method thereof based on the hot melt adhesive composition. The hot melt adhesive composition at least comprises, by weight, 6 to 9 parts of thermoplastic resin with a softening point of 85 to 120 DEG C, 0.40 to 0.60 parts of a tackifier and 73 to 110 parts of a heat-conducting particle. Since the softening point of the thermoplastic resin is high in temperature, the softening point of the prepared hot melt adhesive composition is also high in temperature; and thus, the heat-conducting strip prepared from the hot melt adhesive composition does not flow or deform at a normal usage temperature. The disadvantages of easy flowing and deformation of heat-conducting strips in the prior art are overcome. Moreover, the heat-conducting strip provided by the invention has low thickness, so the heat conduction performance of the heat-conducting strip is improved.

Description

technical field [0001] The invention relates to the field of interface materials for electronic components, in particular to a hot melt adhesive composition and a preparation method thereof, as well as a heat conduction sheet made of the hot melt adhesive composition and a preparation method of the heat conduction sheet. Background technique [0002] Among the types of thermal interface materials, phase change materials are more and more favored by professional designers as a material with superior characteristics such as high heat transfer efficiency and long service life. Specifically, the phase-change interface material has very low thermal resistance and has a much longer lifespan than silicone grease, and can die-cut products that meet the diverse needs of users better than silicon mud products. A characteristic of phase change materials is that when the ambient temperature reaches the phase transition point, the material begins to soften and begins to flow. For the ge...

Claims

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Application Information

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IPC IPC(8): C09J11/04C09J167/02C09J177/00C09J175/04C09J123/08C09J155/02C09J183/04C09J163/00C09J7/00
Inventor 张宇强田海玉
Owner ZHEJIANG SAINTYEAR ELECTRONICS TECH
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