Sn0.3Ag0.7Cu lead-free solder paste and preparation method thereof
A technology of lead solder paste and solder, which is applied in the field of preparation of the above-mentioned Sn0.3Ag0.7Cu lead-free solder paste, can solve the problems of excessive solder paste residue, poor film-forming property, and insufficient viscosity, etc., and achieve chemical protection against moisture and contact Excellent denaturation and good printing performance
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Embodiment 1
[0044] Step 1, weigh 10% flux and 90% respectively according to mass percentage 3 # Sn0.3Ag0.7Cu alloy powder, wherein the soldering flux weighs 23% KE-604 rosin, 20% rosin pentaerythritol ester, 17% adipic acid, 5% hydrogenated castor oil, 2% triethanolamine, 33% four Hydrogen furfuryl alcohol;
[0045] Step 2, add tetrahydrofurfuryl alcohol into the reaction kettle, add rosin pentaerythritol ester at the same time, heat to 75°C, and stir at constant temperature until the solution is uniform and transparent;
[0046] Step 3, cool down the solution obtained in step 2 to 65°C, add KE-604 rosin and adipic acid, and stir until the solution is uniform and transparent;
[0047] Step 4, cool down the solution obtained in step 3 to 55°C, add hydrogenated castor oil, and stir until the solution is uniform and transparent;
[0048] Step 5, stop heating the solution obtained in step 4, add triethanolamine, and continue to stir for 15 minutes after it is cooled to room temperature to o...
Embodiment 2
[0051] Step 1, weigh 11% soldering flux and 89% 4 respectively according to mass percentage #Sn0.3Ag0.7Cu alloy powder, in which the soldering flux weighs 25% KE-604 rosin, 18% rosin pentaerythritol ester, 15% sebacic acid, 10% hydrogenated castor oil, 1% triethanolamine, 31% four Hydrogen furfuryl alcohol;
[0052] Step 2, add tetrahydrofurfuryl alcohol into the reaction kettle, add rosin pentaerythritol ester at the same time, heat to 75°C, and stir at constant temperature until the solution is uniform and transparent;
[0053] Step 3, cool down the solution obtained in step 2 to 65°C, add KE-604 rosin and sebacic acid, and stir until the solution is uniform and transparent;
[0054] Step 4, cool down the solution obtained in step 3 to 55°C, add hydrogenated castor oil, and stir until the solution is uniform and transparent;
[0055] Step 5, stop heating the solution obtained in step 4, add triethanolamine, and continue to stir for 15 minutes after it is cooled to room tem...
Embodiment 3
[0058] Step 1, weigh 9% soldering flux and 91% 3 respectively according to mass percentage # Sn0.3Ag0.7Cu alloy powder, in which flux weighs 20% KE-604 rosin, 15% rosin pentaerythritol ester, 20% azelaic acid and sebacic acid with a mass ratio of 1:1, 6% hard Lipid amide, 3% triethanolamine, 36% tetrahydrofurfuryl alcohol;
[0059] Step 2, add tetrahydrofurfuryl alcohol into the reaction kettle, add rosin pentaerythritol ester at the same time, heat to 75°C, and stir at constant temperature until the solution is uniform and transparent;
[0060] Step 3, cool down the solution obtained in step 2 to 65°C, add KE-604 rosin, azelaic acid and sebacic acid, and stir until the solution is uniform and transparent;
[0061] Step 4, cool down the solution obtained in step 3 to 55°C, add hydrogenated castor oil, and stir until the solution is uniform and transparent;
[0062] Step 5, stop heating the solution obtained in step 4, add triethanolamine, and continue to stir for 15 minutes ...
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