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Radiation paint composition and radiation structure

A technology of heat-dissipating paint and heat-dissipating structure, applied in heat exchange materials, epoxy resin paints, coatings, etc., to achieve excellent effects, prolong life, and suppress temperature rise

Inactive Publication Date: 2015-07-08
HANWHA CHEMICAL CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there has not really been obtained a heat-dissipating coating composition having the ability to form a heat-dissipating layer having excellent salt water resistance, coating film strength, adhesion, scratch resistance, etc.

Method used

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  • Radiation paint composition and radiation structure
  • Radiation paint composition and radiation structure
  • Radiation paint composition and radiation structure

Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0054] A CNT solution was prepared by mixing 10 g of multi-walled carbon nanotubes (CNTs) and 990 g of distilled water. Before injecting the CNT solution into the preheater at a flow rate of 30 g / min, oxygen in the gas phase compressed to 245 atm to 252 atm was mixed with the CNT solution at a flow rate of 0.8 g / min to obtain a mixed solution, and then injected into the Put the mixed solution into a preheater preheated to 200 to 260°C.

[0055] The preheated mixed solution was injected into a reactor to perform surface treatment at a temperature of 350° C. at a subcritical condition of 230 atm to 250 atm. During the surface treatment reaction, ammonia water was injected under high pressure at a flow rate of 0.20 g / min at a pressure of 230 to 250 atm and a temperature of 300 to 350° C. at a position 4 / 5 from the inlet of the reactor for surface treatment . The surface-treated product was first cooled again to 200° C., and then cooled again to about 25° C. to obtain 9.8 g of a...

preparation Embodiment 2

[0057] By mixing and dispersing 30 g of functionalized CNTs prepared in the same manner as in Preparation Example 1 above, 90 g of a modified polyacrylate-based dispersant, and 880 g of a mixed solution of methyl ethyl ketone and 1-propanol. Prepare the CNT dispersion solution.

preparation Embodiment 3

[0059] 46 g of epoxy resin (Kukdo Chemical Co., Ltd., YD 128), 0.2 g of leveler, 11.6 g of MEK, and 14.6 g of 1-propanol were mixed with each other for 10 minutes to obtain a mixed solution. 23 g of the CNT dispersion solution of Preparation Example 2 was mixed with the mixed solution, followed by mixing. Then, 4.6 g of 2-ethyl-4-methylimidazole was mixed with the mixed solution, followed by mixing again for 10 minutes, thereby preparing a heat-dissipating paint composition. The final components of the heat dissipation coating compositions prepared are shown in Table 1 below.

[0060] [Table 1]

[0061]

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Abstract

There are provided a heat dissipation paint composition capable of forming a heat dissipation layer having excellent salt water resistance, coating film strength, adherence property, scratch resistance, and the like, together with excellent heat dissipation property, in various products, and a heat dissipation structure. The heat dissipation paint composition includes: an epoxy resin; a curing agent; a carbon-based filler having a functional group including at least one selected from the group consisting of an amine group, an amide group, a carboxyl group and a hydroxyl group bound thereto; and a solvent.

Description

technical field [0001] The invention relates to a heat dissipation coating composition and a heat dissipation structure. More specifically, the present invention relates to a heat dissipation coating composition capable of forming a heat dissipation layer having excellent salt water resistance, coating film strength, adhesion performance, scratch resistance, etc. and excellent heat dissipation performance in various products, and heat dissipation structure. Background technique [0002] Recently, as Light Emitting Diode (LED) headlights are increasingly applied to automobiles and the like, technical achievements in reducing the temperature of vehicle lamps have been implemented. In particular, LED devices are semiconductor devices that are quite sensitive to temperature, and problems such as lifespan reduction and failure caused by temperature increase during operation can seriously occur. Therefore, it is very necessary to suppress temperature increase and the like of LED...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/00C09D7/12C09D7/62
CPCC08K9/04C09D7/12C09D163/00C08K2201/011C09D7/62C09D7/70C08K5/17C09K5/10
Inventor 全成胤都承会李镇瑞
Owner HANWHA CHEMICAL CORPORATION
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