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A preparation method of a flexible thermoelectric device and the prepared flexible thermoelectric device

A technology of thermoelectric devices and devices, applied in the field of thermoelectric power generation devices, can solve problems such as poor controllability, non-flexible devices, and long material preparation cycle, and achieve the effects of releasing thermal stress, widening application occasions, and large-angle bending

Active Publication Date: 2017-05-03
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Most of the current thermoelectric devices are planar rigid, or flexible on one side, or only cut the ceramic substrate to release thermal stress, not really flexible devices
Or it is a flexible device made into a thin film, but the thin film flexible device has high requirements for material deposition and preparation, the material preparation cycle is long and the controllability is poor

Method used

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  • A preparation method of a flexible thermoelectric device and the prepared flexible thermoelectric device

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Embodiment Construction

[0027] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings. However, those skilled in the art know that the present invention is not limited to the drawings and the following embodiments.

[0028] Such as figure 1 , 2 , 3, 4, and 5, the preparation method of the flexible thermoelectric device proposed by the present invention comprises the following steps:

[0029] (1) According to the application requirements, design a thermoelectric device with P-N semiconductor particle size of 4.5×4.5×2.5 (mm) and a logarithm of 49 P-N semiconductor particles, and cut them.

[0030] (2) Flatten and fix the red copper wire mesh 5 on the lower substrate 6 of the mold, cover the mask plate 4, and carry out the "scraping" operation of the solder on the A side of the device.

[0031] (3) Remove th...

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Abstract

The invention relates to a preparation method of a flexible thermoelectric device and the prepared flexible thermoelectric device. The method uses a copper mesh with high conductivity as the electrode material, directly fixes the copper mesh on the mold substrate, uses high-temperature resistant silica gel as a flexible substrate to replace the traditional ceramic substrate, and alternately drops P-N thermoelectric particles into the grid. On the basis of overall welding in the lattice mold device, the designed pattern is cut on the hot and cold end faces, so that each pair of P‑N semiconductor thermoelectric particles are electrically connected in series and thermally in parallel to form independent structures; and the thickness of the glue can be adjusted The basic curing operation of high-temperature-resistant flexible insulation is performed on the adjustable device to obtain a flexible device. The flexible device of the present invention can be bent at a large angle without changing the body of the semiconductor material and without affecting the composition of the doped and modified semiconductor material. It broadens the application scenarios of thermoelectric devices and is no longer limited to flat applications, releasing Thermal stress generated by the working process of thermoelectric devices.

Description

technical field [0001] The invention belongs to the technical field of thermoelectric power generation devices, and in particular relates to a preparation method of a flexible thermoelectric device and the prepared flexible thermoelectric device. Background technique [0002] Thermoelectric devices are an important means to realize the application of thermoelectric materials. Thermoelectric devices have many advantages such as small size, light weight, no transmission mechanism, and no pollution release, making them have good application prospects and advantages in the fields of industrial waste heat recovery, automobile waste heat recovery, space power supply, and civil refrigeration. At present, most thermoelectric devices are planar rigid, or one side is flexible, or the ceramic substrate is only cut to release thermal stress, and they are not really flexible devices. Or it is a flexible device made into a thin film, but the thin film flexible device has high requirement...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L35/34H10N10/01
Inventor 林紫雄吴立明
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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