Diamond micro-drilling grinding tool

A diamond and diamond particle technology, which is applied in the field of diamond micro-drilling abrasive tools, can solve the problems of difficulty in processing micro-holes, long processing cycle, and high tool cost, so as to improve the phenomenon of grinding head clogging and grinding layer wear, and improve the quality of micro-holes And dimensional consistency, shorten the effect of processing cycle

Active Publication Date: 2015-06-24
NORTHEASTERN UNIV
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  • Abstract
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Problems solved by technology

However, it is very difficult to machine micro-pores on the surface of such hard and brittle materials, and the cost of tools occupied by the machining process is usually high
[0003] At present, the grinding tools commonly used in the processing of micro-holes (hole diameter less than 1mm) are diamond micro-drilling abrasives. Due to the limitation of the structure, only the spiral cutting metho

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  • Diamond micro-drilling grinding tool
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Embodiment Construction

[0017] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0018] Such as figure 1 , 2 , shown in 3, a kind of diamond micro-drilling abrasive tool comprises base body 7 and grinding layer, and grinding layer is diamond particle layer, and grinding layer is plated on base body surface by electroplating mode, and described base body 7 tops are arranged as grinding head 1 , the top end surface of the grinding head 1 is a plane, a cross-shaped groove 2 is provided on the top end surface of the grinding head 1, and a central hole 3 for eliminating the low-speed grinding zone is provided in the axial center of the grinding head 1.

[0019] A stepped base 4 is provided between the grinding head 1 and the base 7 .

[0020] The stepped base 4 includes a primary reaming step 5 and a secondary reaming step 6 , the primary reaming step 5 is located on the grinding head 1 side, and the secondary reamin...

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Abstract

A diamond micro-drilling grinding tool comprises a base body and a grinding layer. The grinding layer is a diamond particle layer and is arranged on the surface of the base body in an electroplated mode, and the thickness of the grinding layer ranges from 0.04 mm-0.08 mm. The top end of the base body is arranged to be a grinding head, the top end face of the grinding head is a plane and is provided with a cross-shaped semicircular groove, and a center hole used for eliminating a low-speed grinding area is formed in the axial center of the grinding head. A step-shaped base is arranged between the grinding head and the base body and comprises a primary chambering step on the grinding side and a secondary chambering step on the base body side. The diamond micro-drilling grinding tool is mainly used for drilling and grinding micro holes of crisp and hard materials, a vertical tool feeding mode can be achieved and makes tool setting and machining program compiling easier compared with a traditional spiral tool feeding mode, and the machining period is effectively shortened. The phenomena that a micro grinding head is blocked and a grinding layer is abraded are effectively improved, the quality and size uniformity of the micro holes is improved, and the service life of the grinding tool is prolonged.

Description

technical field [0001] The invention belongs to the technical field of micro-drill grinding, in particular to a diamond micro-drill grinding tool. Background technique [0002] At this stage, the mechanical precision machining of fine features on hard and brittle materials has been widely used in manufacturing, such as the processing of micro holes and micro grooves on the glass cover of mobile phones. However, it is very difficult to machine micro-pores on the surface of such hard and brittle materials, and the cost of tools occupied by the machining process is usually high. [0003] At present, the grinding tools commonly used in the processing of micro-holes (hole diameter less than 1mm) are diamond micro-drilling abrasives. Due to the limitation of the structure, only the spiral cutting method can be used to process the micro holes, but this processing method is also accompanied by many shortcomings, including long processing cycle, difficult tool setting, complicated p...

Claims

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Application Information

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IPC IPC(8): B24B5/48
CPCB24B5/48
Inventor 程军巩亚东温雪龙王超尹国强
Owner NORTHEASTERN UNIV
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