Precision laser cutting and micro-hole machining device

Abstract

The invention relates to the field of laser application, in particular to a precision laser cutting and micro-hole machining device. The precision laser cutting and micro-hole machining device comprises a laser as well as a beam expansion device, a front-end reflective mirror, a rear-end reflective mirror and a focusing lens which are arranged in sequence along a light path, wherein at least one beam shaping system used for shaping Gaussian laser beams into flat-top laser beams and at least one beam optimization system used for optimizing the Gaussian laser beams are arranged between the front-end reflective mirror and the rear-end reflective mirror; the front-end reflective mirror is used for reflecting the Gaussian laser beams passing through the beam expansion device into the beam shaping system or the beam optimization system; the rear-end reflective mirror is used for reflecting laser beams emitted by the beam shaping system or the beam optimization system into the focusing lens. Only by switching the beam shaping system or the beam optimization system for production and machining, switching between micro-hole machining and cutting machining can be realized, so that the operation is simple and the production efficiency is high; with the adoption of the beam shaping system, the micro-hole machining quality can be effectively improved while the laser utilization rate is increased and the laser machining efficiency is improved.

Description

technical field [0001] The invention relates to the field of laser applications, in particular to a precision laser cutting and microhole processing device. Background technique [0002] At present, laser processing, as an advanced manufacturing technology in the processing field, has been widely used in important sectors of the national economy such as automobiles, electronics, electrical appliances, aviation, metallurgy, and machinery manufacturing. play an increasingly important role. [0003] Laser processing technology uses a focused high-power-density laser beam to irradiate the processing material, so that the irradiated material is rapidly melted and vaporized, and at the same time, the molten material is blown away by the high-speed airflow coaxial with the beam, and the motion system drives the processing workpiece or cutting device to move , so as to realize the cutting or punching of the workpiece. [0004] The cutting of the workpiece generally adopts such as ...

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Problems solved by technology

[0007] The technical problem to be solved by the present invention is to provide a precision laser cutting and microhole processing device for the above-mentioned defects of the prior art, which overcomes the low laser utilization rate and large energy loss when Gaussian laser is used to process microholes in the prior art. , when processing micro-through holes and blind holes, the edge of the hole is not smooth, as the hole continues to deepen, it will produce a taper, and the bottom of the hole is prone to depression during blind hole processing, and even breaks down the bottom of the hole in serious cases; when the same workpiece is to be processed When cutting and processing micro-holes or processing micro-holes with different apertures, the processing procedure is complicated and the production efficiency is low.

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