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Radiator for semiconductor refrigerator

A heat sink and semiconductor technology, applied in the field of heat transfer, can solve the problems of heat sink with obvious thermal resistance, limited heat dissipation capacity, and low heat dissipation efficiency, and achieve good heat dissipation effect, high heat dissipation efficiency, and improved heat dissipation efficiency

Inactive Publication Date: 2015-06-03
陈伟峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for a long time, the heat dissipation method of semiconductor refrigerators is to use finned aluminum alloy radiators. Due to the limitations of solid metal structure and thermal conductivity, the thermal resistance of radiators is obvious, the temperature gradient is large, and the heat dissipation area is small. Limited heat dissipation capacity and low heat dissipation efficiency

Method used

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  • Radiator for semiconductor refrigerator
  • Radiator for semiconductor refrigerator

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Embodiment Construction

[0008] The present invention will be further described below in conjunction with accompanying drawing.

[0009] Such as figure 1 As shown, the foamed aluminum (3) on the radiator is a cubic porous aluminum foam metal material, and the plane size of the foamed aluminum (3) is consistent with the plane size of the vapor chamber (1); the vapor chamber (1) and the foam The aluminum (3) is integrated by welding; the radiator is provided with fixing holes (4).

[0010] Such as figure 2 As shown, the temperature chamber (1) is a rectangular aluminum plate; the heat pipe (2) is arranged in the bottom groove of the temperature chamber (1).

[0011] The working principle of the present invention: when using the radiator for semiconductor refrigerators provided by the present invention, in order to reduce the thermal resistance, apply an appropriate amount of heat-conducting silicon grease on the heating surface of the semiconductor chip, and directly place the central position of the...

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Abstract

The invention provides a radiator for a semiconductor refrigerator. The radiator for the semiconductor refrigerator comprises a temperature equilibrium plate (1), heat conducting pipes (2) and foamed aluminum (3) and is characterized in that the heat conducting pipes (2) are arranged on the bottom face of the temperature equilibrium plate (1), and the foamed aluminum (3) is a porous foamed aluminum metal material. The radiator for the semiconductor refrigerator is high in heat conducting speed, good in temperature equilibrium effect, low in material density, large in specific surface area, good in air permeability, high in heat dissipation efficiency, light in weight, low in price, simple in structure and easy to manufacture.

Description

technical field [0001] The invention relates to the field of heat transfer, in particular to a radiator for semiconductor refrigerators. Background technique [0002] Semiconductor refrigerators have outstanding advantages such as no refrigerant, simple structure, rapid cooling, flexible assembly, and easy maintenance. They have been popularized and applied in various fields in recent years. However, for a long time, the heat dissipation method of semiconductor refrigerators is to use finned aluminum alloy radiators. Due to the limitations of solid metal structure and thermal conductivity, the thermal resistance of radiators is obvious, the temperature gradient is large, and the heat dissipation area is small. The heat dissipation capacity is limited and the heat dissipation efficiency is low. Contents of the invention [0003] In order to solve the technical problems of the above radiator, the present invention provides a radiator for semiconductor refrigerators, which h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25D23/10
CPCF25D23/10
Inventor 陈伟峰
Owner 陈伟峰
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