Double-layer titanium aluminum/aluminum silicon composite material as well as preparation method and application thereof

Abstract

The invention relates to a double-layer titanium aluminum / aluminum silicon composite material as well as a preparation method and application thereof, and belongs to the technical field of preparation of electronic packaging materials. The titanium aluminum / aluminum silicon composite material comprises a titanium aluminum alloy layer, an aluminum silicon alloy layer and a transition layer positioned between the titanium aluminum alloy layer and the aluminum silicon alloy layer. The preparation method comprises the following steps: sintering aluminum powder and titanium powder under high temperature and high pressure to form a titanium aluminum alloy substrate, and then sintering premixed aluminum powder and silicon powder with the sintered and molded titanium aluminum substrate for the second time in a mold under a lower temperature and higher pressure, so as to obtain a titanium aluminum / aluminum silicon electronic packaging material blank with double-layer composite structure; and then annealing by vacuum diffusion, so as to obtain the titanium aluminum / aluminum silicon composite material. The preparation method has the advantages of short process, easiness in control over process parameters and the like; each performance of the prepared titanium aluminum / aluminum silicon composite material is excellent, especially the interface bonding property is attractive, so the material can be used as an electronic packaging material.

Description

technical field [0001] The invention relates to a double-layer titanium-aluminum / aluminum-silicon composite material and its preparation method and application; it belongs to the technical field of preparation of electronic packaging materials. Background technique [0002] In recent years, with the rapid development of microelectronic integrated circuit technology, the integration and power of electronic devices have been continuously improved, resulting in more and more performance requirements for thermal management packaging materials that provide mechanical support, heat conduction and environmental protection for these electronic devices. high. The performance of thermal management packaging materials directly affects the electrical, thermal, sealing, and mechanical performance of integrated circuits and electronic devices. Therefore, in the design of packaging materials, it is not only necessary to consider its thermal performance requirements, but also to consider t...

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Problems solved by technology

[0008] The above technologies such as welding, infiltration, and rolling compounding can obtain layered composite materials, but there are problems with the interface of composite materials. In the field of electronic packaging, it is necessary to realize the compounding of different types of materials with large differences in properties. are impossible

[0009] According to the summary of data and literature, it is difficult to fully meet the requirements of different thermal expansion coefficients and thermal conductivity in the actual application process if the thermal management material used in the field of electronic packaging is a single material. Materials combined for use

At present, the process of joining these different materials is generally laser welding technology. Welding is likely to cause the hidden danger of deterioration of the mechanical properties and sealing performance of the packaging materials or packaging components in the heat-affected zone of the weld seam. It will bring about the mismatch of physical and mechanical properties of different materials at the weld. In the subsequent use process, it is often affected by thermal stress and other problems, resulting in weld cracking and other problems.

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