Heat radiation device

Abstract

The invention provides a heat radiation device. The heat radiation device is disposed on a main board. The heat radiation device comprises a first heat radiator, which is fixed on the main board and disposed on an air flow direction of a fan; a second heat radiator, which is fixed on the main board and disposed at the air flow direction of the fan, and which is far from the fan in relative to the fist heat radiator; and a wind shielding board, which is vertical to the main board, fixed between the first heat radiator and the second heat radiator, and provided with a notch having a size the same with the size of an end surface of the second heat radiator. With the heat radiation device, air flow management is optimized with minimum cost.

Description

【Technical field】 [0001] The invention is a heat dissipation device, especially a heat dissipation device suitable for multi-node servers. 【Background technique】 [0002] The management of the system flow field plays a very important role in the field of heat dissipation of electronic products. Good management can optimize the temperature of system parts and achieve good temperature management at the lowest cost. With the continuous improvement of the output power and operating frequency of electronic components such as central processing units, the corresponding heat generated by them has also increased significantly. If the heat generated is not removed in time, the accumulated heat will cause the temperature to rise, which will seriously affect the electronic components. of normal operation. For this reason, the industry usually installs a heat sink on the surface of these heating elements for auxiliary heat dissipation, and at the same time installs a fan at one end of ...

AI Technical Summary

Problems solved by technology

In order to take into account the needs of some electronic components that do not require high heat dissipation, traditional heat sinks will arrange the electronic components that do not require high heat dissipation on one side of the heat sink so that part of the wind energy of the fan can blow. For the electronic components with low heat dissipation requirements, however, such an arrangement often results in waste of air volume due to the wind blowing to the electronic components with low heat dissipation requirements exceeding its own heat dissipation requirements, thereby reducing heat dissipation The heat dissipation effect of the device, and the heat dissipation demand of the memory module is gradually decreasing, which means that the air flow required by the memory module is getting lower and lower, and the CPU can get more air flow.

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