Method and device for testing qualification of data line, array substrate and manufacturing method thereof

An array substrate and testing method technology, applied in the field of data line qualification testing, can solve the problems of sealing glue corrosion, package failure, electrochemical corrosion of metal test lines, etc., and achieve the effect of avoiding package failure

Active Publication Date: 2015-05-20
BOE TECH GRP CO LTD +1
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  • Abstract
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  • Application Information

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Problems solved by technology

During the follow-up reliability test, the exposed metal test line will be electrochemically corroded, which will eventually lead to the corrosion of the sealant above it, which will also lead to package failure

Method used

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  • Method and device for testing qualification of data line, array substrate and manufacturing method thereof
  • Method and device for testing qualification of data line, array substrate and manufacturing method thereof
  • Method and device for testing qualification of data line, array substrate and manufacturing method thereof

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Embodiment Construction

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0031] An embodiment of the present invention provides a data line qualification testing method, such as figure 2 As shown, the method may include the following processes:

[0032] Step S1, lighting up the first pixel closest to the data drive circuit according to the first preset data voltage, and lighting up the second pixel farthest from the ...

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Abstract

The invention provides a method and a device for testing qualification of a data line, an array substrate and a manufacturing method thereof. The method for testing the qualification of the data line comprises the following steps of according to first preset data voltage, illuminating a first pixel which is closest to a data driving circuit, and according to second preset data voltage, illuminating a second pixel which is farthest from the data driving circuit; correspondingly connecting the first pixel and the second pixel to the same to-be-tested data line; obtaining the brightness of the first pixel and the brightness of the second pixel; judging whether the actual brightness difference between the brightness of the first pixel and the brightness of the second pixel is greater than the preset brightness difference or not; when the actual brightness difference is greater than the preset brightness difference, judging that the tested data line does not meet the requirement. The method for testing the data line has the advantages that the qualification test of the data line can be completed under the condition of no arrangement of the metal line, and the problem of packaging failure caused by the arrangement of the metal line is fundamentally solved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a data line qualification testing method and device, an array substrate and a manufacturing method thereof. Background technique [0002] During the manufacturing process of the array substrate, it is necessary to test whether the resistance of the formed data lines is qualified. A testing method in the prior art is to fabricate metal test lines at the same time when fabricating the array substrate. The metal test lines lead from the data drive circuit and extend to the data drive circuit through the edge area outside the sealant area of ​​the panel. By measuring the voltage at the end of the metal test line at the opposite end of the data drive circuit to determine the voltage drop of the metal test line, and then the voltage drop of the data line can be simulated to determine whether the line resistance of the data line is qualified. Since the ring-shaped common electrode pat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L21/82H01L27/02
CPCH01L21/77H01L22/12H01L27/12H01L22/14G01R31/58G09G3/006H01L27/124H01L27/1262
Inventor 张博
Owner BOE TECH GRP CO LTD
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