Method for laser sealing glass frit and laser sealing system

A technology for sealing glass and frit, applied in laser welding equipment, manufacturing tools, electric solid state devices, etc., can solve the problems of unstable laser, packaging failure, incomplete sealing, etc., to avoid incomplete sealing or sealing rupture. Effect

Active Publication Date: 2019-09-17
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Application Information

AI Technical Summary

Problems solved by technology

This type of packaging may have incomplete sealing or cracks in the Overlap area, such as figure 1 and Figure 2A , 2B
Specifically, the use of point lasers may cause the laser to be unstable due to the acceleration and deceleration of the laser head at the start and end areas of the package, resulting in package failure in this area.

Method used

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  • Method for laser sealing glass frit and laser sealing system
  • Method for laser sealing glass frit and laser sealing system
  • Method for laser sealing glass frit and laser sealing system

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Embodiment Construction

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiment of the invention is shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more related listed items....

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Abstract

The present invention relates to a method and a laser sealing system for laser sealing glass frit, the method comprising: emitting a laser beam; dispersing the laser beam into a laser beam with a longer spot and more uniform energy than before dispersion through a beam splitter; The laser beam is introduced into the chamber used for sealing the glass frit; the laser beam is focused and corrected to form a line laser, and the line laser is irradiated on the glass frit used for sealing the semiconductor components. In the present invention, the point laser in the traditional technology is processed into a line laser with a long spot and uniform energy, and then the semiconductor components are sealed by melting the glass frit through the line laser, which well avoids the overlapping (Overlap) area in the laser sealing process due to laser An incomplete or broken seal caused by energy instability.

Description

Technical field [0001] The invention relates to laser beam processing, in particular to a method for laser sealing glass frit, and also to a laser sealing system. Background technique [0002] The current AMOLED (active matrix organic light emitting diode) packaging method generally uses a spot laser to melt and seal the frit. This packaging method may have incomplete sealing or cracks in the overlap area, such as figure 1 with Figure 2A , 2B . The specific reason is that in the beginning and end areas of the package, the use of a spot laser may cause the laser head to be unstable due to the acceleration and deceleration process of the laser head, causing the package failure problem in this area. Summary of the invention [0003] The purpose of the present invention is to avoid incomplete sealing or cracking during laser sealing of glass frit. In order to achieve the above objective, the present invention provides a laser sealing method. [0004] A method for laser sealing glass ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/073B23K26/20H01L51/56H01L51/52
CPCB23K26/0738B23K26/206H10K50/8426H10K71/00
Inventor 薛慕蓉
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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