Hypoeutectic aluminum-silicon alloy with excellent thermal conductivity, preparation method and application thereof

Abstract

The invention discloses a hypoeutectic aluminum-silicon alloy with excellent thermal conductivity. The alloy comprises the following chemical components: 5-9 wt% of Si, smaller than 0.5 wt% of Mg, smaller than 0.5 wt% of Cu, smaller than 0.7 wt% of Fe, smaller than 0.3 wt% of Mn, inevitable impurity elements and the balance of Al, a single inevitable impurity element is not less than 0.05 wt%, and the total amount of the inevitable impurity elements is lower than 0.25 wt%. The hypoeutectic aluminum-silicon alloy with thermal conductivity of 170-200 W / (m.K) can be obtained in a preparation process by such technical means as controlling the chemical components of the alloy and casting, and thermal treatment and the like. Good castability and mechanical properties of the aluminum-silicon alloy are guaranteed, and excellent thermal conductivity of the aluminum-silicon alloy is guaranteed at the same time.

Description

technical field [0001] The invention belongs to the field of nonferrous metal forming and processing, and in particular relates to a hypoeutectic aluminum-silicon alloy and a preparation method thereof. Background technique [0002] Aluminum-silicon alloy has the characteristics of small crystallization temperature interval, large latent heat of solidification and large specific heat capacity of its silicon phase; small linear shrinkage coefficient, thermal cracking and shrinkage tendency, so its casting performance is better than other aluminum alloys. Since the Al-Si alloy eutectic has good plasticity and can better balance the requirements of both mechanical properties and casting properties, Al-Si alloys are currently the most widely used casting alloys. Among them, the hypoeutectic aluminum-silicon alloy not only has good processability, but also has good casting performance, welding performance and thermal conductivity, and has been widely used in aerospace, transporta...

AI Technical Summary

Problems solved by technology

[0003]The current general-purpose eutectic aluminum-silicon alloy heat-conducting material has become increasingly prominent due to the limitation of its thermal conductivity. Taking the most commonly used ZL101 alloy as an example, its The as-cast thermal conductivity is 130W / (m K), and after T6 treatment, the thermal conductivity is 155W / (m K). Although its thermal conductivity is higher than that of ZL102 alloy 120W / (m K), it still cannot Meet the heat dissipation needs of related products for more miniaturization and multi-function

Images