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Cu-W/Cu-Cu composite board preparation method

A composite plate, cu-cu technology, applied in the field of composite plate preparation, to achieve good process compatibility, small residual deformation and stress, and good matching

Inactive Publication Date: 2015-05-20
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, domestic research has only been carried out on Cu-Mo / Cu-Cu materials, but for Cu-W / Cu-Cu composite materials, there is no relevant literature report in China, and Cu-W / Cu-Cu composite materials are completely dependent on foreign imports. The company composites the material on the power tube equipment and sells it as a whole, and does not sell the material separately, and the preparation process of the material is completely confidential

Method used

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  • Cu-W/Cu-Cu composite board preparation method
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  • Cu-W/Cu-Cu composite board preparation method

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Embodiment 1

[0023] In this embodiment, a 3mm Cu-W / Cu-Cu composite plate with a layer thickness ratio of 1:1:1 and a Cu volume fraction of 50% in the W / Cu plate 2 is prepared. The preparation process includes the following steps:

[0024] Step 1: select the oxygen-free copper Cu plate 1 that two thicknesses are 1.1mm (leave 0.1mm processing residue), select a 1mm W / Cu plate 2 that the Cu volume fraction is 50% for use (due to heat isostatic The pressure medium is a gas phase uniform pressure, which basically does not affect the final size of the dense material), and the Cu skin 3 for coating is 0.1mm. The oxygen-free copper Cu plate 1 on the upper and lower surfaces is closely attached to the Cu skin 3, completely wrapping the tungsten copper ( figure 1 ), fix the outer layer copper and tungsten copper core by tooling. Use high-temperature-resistant BNi2 solder to vacuum braze the Cu skin 3 on the side of the W / Cu plate 2 and the Cu plate 1 that is attached to the top and bottom to form a...

Embodiment 2

[0029] In this embodiment, a 15mm Cu-W / Cu-Cu composite plate with a layer thickness ratio of 1:3:1 and a Cu volume fraction of 30% in the W / Cu layer is prepared. The preparation process includes the following steps:

[0030] Step 1: select the oxygen-free copper Cu sheet material 1 that two thicknesses are 3.1mm (leaving 0.1mm processing residue), select a 9mm W / Cu sheet material 2 that the volume fraction of Cu is 30% (due to heat isostatic The pressure medium is a gas phase uniform pressure, which basically does not affect the final size of the dense material), and the Cu skin 3 for coating is 0.1mm. The oxygen-free copper Cu plate 1 on the upper and lower surfaces is closely attached to the Cu skin 3, completely wrapping the tungsten copper ( figure 1 ), fix the outer layer copper and tungsten copper core by tooling. Use high-temperature-resistant BNi2 solder to vacuum braze the Cu skin 3 on the side of the W / Cu plate 2 and the Cu plate 1 that is attached to the top and bo...

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Abstract

The invention provides a Cu-W / Cu-Cu composite board preparation method. According to the method, based on sealing weld and hot isostatic pressure technologies, structure optimization is conducted on sandwich composite materials, and finally near-net formed products are prepared. The Cu-W / Cu-Cu composite board preparation method is short in technological process, near-net in forming, especially suitable for large-scale industrial production and high in composite interlamination binding force, the strength and thermal property of the composite materials are guaranteed effectively, and the heat dissipation problem of high-dissipation-power electronic devices can be solved.

Description

technical field [0001] The invention relates to a method for preparing a Cu-W / Cu-Cu composite board, which belongs to the technical field of composite board preparation. Background technique [0002] With the development of chip miniaturization, integration, and power, heat sink materials with high thermal conductivity have always been the development trend of electronic component packaging. [0003] The tungsten copper heat sink material can make the thermal expansion coefficient close to that of non-metallic substrates such as ceramics by adjusting the ratio of the two phases, so that the residual stress after brazing is small. However, the highest thermal conductivity of tungsten copper is only about 190W / (m·K), which is close to its theoretical value, and further improvement is limited. [0004] In order to make up for the lack of performance of a single material, many heat sink materials used in foreign high-power equipment are used in the form of multi-layer composite...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00
CPCB21C37/02B23P15/00
Inventor 李鹏吴欣程耀永熊华平毛唯陈波
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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