Manufacturing method and structure of low-temperature polycrystalline silicon TFT substrate
A technology of low-temperature polysilicon and its manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems affecting the quality of low-temperature polysilicon TFT substrates, poor uniformity of the display area, and the electron mobility of the driving circuit in the driving area to be improved. and other issues, to achieve the effect of high quality, uniform electrical properties, and easy operation
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[0055] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.
[0056] see figure 1 , the invention provides a method for manufacturing a low-temperature polysilicon TFT substrate, comprising the steps of:
[0057] Step 1, such as image 3 As shown, a substrate 1 is provided on which a buffer layer 2 is deposited.
[0058] The substrate 1 is a transparent substrate, preferably, the substrate 1 is a glass substrate or a plastic substrate.
[0059] Specifically, the material of the buffer layer 2 may be silicon nitride (SiNx), silicon oxide (SiOx), or a combination of both.
[0060] Step 2, such as Figure 4-5 As shown, the amorphous silicon layer 3 is deposited and patterned on the buffer layer 2 to obtain first amorphous silicon segments 33 located in the display area and second amorphous silicon segme...
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